参数资料
| 型号： | 10368-32J0-000 |
| 厂商： | 3M |
| 文件页数： | 13/32页 |
| 文件大小： | 0K |
| 描述： | JUNCTION SHELL 68POS BIEGE |
| 标准包装： | 100 |
| 系列： | 103 |
| 附件类型： | 两件后壳/盖 |
| 位置数： | 68 |
| 缆线类型： | 圆形 |
| 线缆出口： | 180° |
| 屏蔽： | 屏蔽 |
| 材质： | 金属外壳 - 钢/塑料盖 |
| 镀层： | 镍 |
| 硬件： | 组装硬件，缆线夹 |
| 特点： | 配接螺钉 4-40 |
| 颜色： | 浅褐 |
| 其它名称： | 05111152238 1036832J0000 5111152238 51111522387 80400004398 |
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3M ? DEVICE-TO-BOARD
CONNECTOR SOLUTIONS
PRODUCT
CF CARD HEADERS, COMPACTFLASH ?
SERIES N7E50
CF CARD EJECTORS, COMPACTFLASH ?
SERIES 7E50
SERIAL ATTACHED SCSI
(SAS) CONNECTORS
SERIES SBR AND SBH
SERIAL ADVANCED TECHNOLOGY
ATTACHMENT (SATA) CONNECTORS
SERIES 5607 AND 5622
3M.com/interconnects
FEATURES
? ROHS COMPLIANT
? Headers for Both Type
I and II Cards
? Wide Array of Connector
Size Options to Balance
Between Footprint Size
and Functionality
? ROHS COMPLIANT
? Mates to Selected N7E50
Series CF Headers to Provide
Added Ejection Functionality
? Multiple Button Styles and
Orientations Allow
Design Flexibility
? ROHS COMPLIANT
? 6.0 Gbps Input/Output Connector
for Backplane Applications
? Two Contact Mating Levels for
Early-Mate and Late-Break
Allows “Blind Mating” or “Hot Swap”
Applications
? Capable of Accepting SFF-Compliant
HDD Fitted with SAS or Serial
Advanced Technology Attachment
(SATA) Header
OPTIONS
? Elevated Receptacle Version for
Additional Backplane Stand-off
? Plated Through-Hole, Press-Fit or
SMT Available
? Right Angle Version Available
? 29-Position Device Plugs for Drive
Interface
? 29-Position Combo with Power
? ROHS COMPLIANT
? 3 Gbps I/O Connector
for HDD Applications
? EMLB Contacts for Hot Swap
? Blind Mate Polarization
? Meets SATA 2.6 Specifications
OPTIONS
? Plated Through-Hole, Press-Fit or
SMT Available
? Extended Height Receptacles for
Additional Backplane Standoff
? Right Angle Surfacemount
Receptacle
? 7-Pin Signal Plug
? 22-Position Device Plugs for Drive
Interface
? 22-Position Combo wih Power
MATERIALS
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
FLAMMABILITY UL 94V-0
PLATING
Underplating: 2.03 μm [ 80 μ"] Nickel
Wiping Area: 0.38 μm
[ 15 μ" ] or 0.76 μm [ 30 μ" ] Gold
Button
Material: Glass-Filled High
Temperature Thermoplastic
FRAME
Material: Stainless Steel
FLAMMABILITY UL 94V-0
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50 μ" [1.27 μm] Nickel
Wiping Area: 30 μ" [0.76 μm] Gold
Solder Tails: 100 μ" [ 2.54 μm ] Tin
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50 μ"
[ 1.27 μm ] Nickel
Wiping Area: 30 - 40 μ"
[ 0.76 μm ] Gold
Solder Tails: 100 μ"
[ 2.54 μm ] Tin
PERFORMANCE
CURRENT RATING: 0.5 A
TEMPERATURE RATING: -40°C to +85°C
PROCESS RATING: 260°C (per J-STD-020C)
CURRENT RATING:
Power Pin: 1.5 A
Signal Pin: 500 mA
TEMPERATURE RATING: -40°C to +85°C
CURRENT RATING:
Power Pin: 1.5 A
Signal Pin: 500 mA
TEMPERATURE RATING:
Operating Temperature: 0°C to +55°C
Non-Operating Temperature: -40°C to +85°C
13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 10368-32J0-006 | 功能描述:D-Sub后壳 MDR/TSCREW SHLL/BLCK RoHS:否 制造商:Amphenol Commercial Products 类型:Two Piece Backshell 电缆引入数量:1 电缆引入角:Straight 系列:17E 电缆直径: 位置数量:9 外壳大小:E 外壳电镀:Zinc |
| 10368-3540-000 | 功能描述:D-Sub后壳 68/MDR/SHELL/60 DEGREE/PLASTIC RoHS:否 制造商:Amphenol Commercial Products 类型:Two Piece Backshell 电缆引入数量:1 电缆引入角:Straight 系列:17E 电缆直径: 位置数量:9 外壳大小:E 外壳电镀:Zinc |
| 1036840000 | 制造商:Weidmuller 功能描述:CONN HEADER 3POS 3.81MM BLACK |
| 1036850000 | 制造商:Weidmuller 功能描述:CONN HEADER 4POS 3.81MM BLACK |
| 1036850-1 | 制造商: 功能描述: 制造商:undefined 功能描述: |
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