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参数资料
| 型号： | 109G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 9/116页 |
| 文件大小： | 0K |
| 描述： | INSULATOR |
| 标准包装： | 1,000 |
| 套管，扣眼类型： | 扣眼 |
| 尺寸： | 圆形 - 0.375" OD x 0.141" ID x 0.218" H（9.52mm x 3.58mm x 5.54mm） |
| 适用于相关产品： | 线缆，导线 |
| 材质： | 聚四氟乙烯（PTFE） |
| 颜色： | 黑 |
| 其它名称： | 036515 109GAA |
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How To Select a Heat Sink
How to select a heat sink
The basic equation for heat transfer or power dissipation may be stated as follows:
PD =
Δ T
Σ R θ
Where:
PD = the power dissipated by the semiconductor device in watts.
Δ T = the temperature difference of driving potential which causes the flow of heat.
Σ R θ = the sum of the thermal resistances of the heat flow path across which Δ T exists.
The above relationship may be stated in the following forms:
PD =
TJ–TA
R θ JC + R θ CS + R θ SA
PD =
TC–TA
R θ CS + R θ SA
PD =
TS–TA
R θ SA
Where:
TJ = the junction temperature in ° C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in ° C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in ° C.
TA = ambient air temperature in ° C.
R θ JC = thermal resistance from junction to case of the semiconductor device in ° C per watt
(usually stated by manufacturer of semiconductor device).
R θ CS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in ° C per watt.
R θ SA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in ° C per watt.
The above equations are generally used to determine the required thermal resistance of the heat sink (R θ SA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
FIGURE 1
Mounting surface
(cooler/dissipator)
Interface
Atmosphere
or ambient
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
FIGURE 2
Junction
(heat source)
T
A
TJ
TC
TS
TA
P
D
P
D
Semiconductor case
R θ JC
R θ CS
R θ SA
R
θ CS
R
θ SA
Heat flow path mounting
surface to ambient, equation (3)
R
θ JC
T
J
T
T
C
S
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
T
A
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
ASIA
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
www.aavidthermalloy.com
EUROPE
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
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相关代理商/技术参数 |
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|---|---|
| 109-G-GT1-20/20-18 | 制造商:. 功能描述: |
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| 109H | 功能描述:变压器音频和信号 600 ct 600 ct RoHS:否 制造商:Skyworks Solutions, Inc. 频率范围:810 MHz to 960 MHz 初级线圈阻抗: 次级线圈阻抗: 绝缘电压:23 dB 工作温度范围:- 40 C to + 85 C 端接类型:SMD/SMT 尺寸:6 mm L x 4.9 mm W x 1.6 mm H 产品:Splitters and Combiners |
| 109HM1 | 功能描述:基本/快动开关 SPDT ROLLER LVR 0.5A 28VDC SW SNAP ACTION RoHS:否 制造商:Omron Electronics 触点形式:SPDT 执行器:Lever 电流额定值:5 A 电压额定值 AC:250 V 电压额定值 DC:30 V 功率额定值: 工作力:120 g IP 等级:IP 67 NEMA 额定值: 端接类型:Wire 安装:Panel |
| 109HM41 | 功能描述:基本/快动开关 SPDT 28VDC 0.5A PNL MNT ROLLER LEVER RoHS:否 制造商:Omron Electronics 触点形式:SPDT 执行器:Lever 电流额定值:5 A 电压额定值 AC:250 V 电压额定值 DC:30 V 功率额定值: 工作力:120 g IP 等级:IP 67 NEMA 额定值: 端接类型:Wire 安装:Panel |
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