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参数资料
| 型号： | 110IMX7-24-9C2Z |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 7 W DC-DC REG PWR SUPPLY MODULE |
| 文件页数： | 10/18页 |
| 文件大小： | 299K |
| 代理商： | 110IMX7-24-9C2Z |
Board Mountable
DC-DC Converters
IMX 7 Series
Edition 6/5.2000
18/18
Fig. 29
Out OK signal with corresponding transistor status
t
Uo [V]
UD low
UD high
Output
voltage
Uo Hyst
tD on delay
Out OK
tr on
tD off delay
11032
Fig. 28
Option D, Out OK
11
14
Vo+
Vo–
D
UD
ID
Rp
10
Output
control
circuit
11031
Option C
The C-pinout configures the electrically isolated double out-
puts to the "industrial pinout" Vo1+, Vo2– with common
ground Go. With the C-pinout the converter height is in-
creased by the adapter PCB (see also:
Mechanical Data).
Option D
Single output units can be provided with an Out OK func-
tion. The D-output is an open collector transistor output ref-
erenced to Vo– and indicates that the output voltage is
above approximately 90 % of the specified nominal output
voltage. It can for example be used for remote signalling or
to prevent a connected system from starting up at a low out-
put voltage. The current
ID through the NPN transistor
should not exceed 20 mA. The NPN output is not protected
against external overvoltages.
UD should not exceed 25 V.
Option D excludes option -8.
Table 18: Out OK characteristics
Out OK
3.3 V units 5.1 V units Unit
characteristics
Uo
min
max
min
max
UD low
D output conducting
≥3.0
≥4.75 V
UD high
D output disabled
≤2.85
≤4.5
Uo Hyst
Hysteresis
30 (typical)
mV
tD on delay
Transistor on delay
140
560
140
560
ms
tD off delay
Transistor off delay
100
s
Option M and L
Surface mount version.
Note: Precautions should be taken when reflow soldering
the SMD version. The reflow soldering instructions below
should be strictly adhered to. An inadequate soldering pro-
cess may permanently damage the converter or degrade
its performance and Power-One will not honour any gua-
rantee/warranty claims resulting from damage caused by
ignoring the soldering instructions.
Infrared soldering is not permitted.
The surface mountable version of this product is assem-
bled with high melting point solder (227
°C) to ensure that
the solder joints of of the internal components do not de-
grade in the end users SMD soldering process.
This product is only specified for "Forced Convection
Reflow Soldering" (Hot Air). Any conventional soldering
profile is acceptable provided that the restriction curve be-
low is not exceeded at any time during the reflow process.
210
220
230
240
0
10
20
30
Tpeak [°C]
11051
40
t [s]
50
205
215
225
235
Fig. 30
Forced convection reflow soldering restriction curve
measured on pin 2
Fig. 31
Proposed solder lands option M
50
3.81
Top view
09119
4
x
3.81
25.4
3
x
5.8
3.81
4
2
24
(0.94")
2.8
(0.11")
3.6 (1.4")
8 x 5 (1.9")
Foot print
Fig. 32
Proposed solder lands option L
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