参数资料
型号: 12-5-470
厂商: 3M (TC)
文件页数: 1/2页
文件大小: 0K
描述: TAPE ELECTROPLATING 12"X5YD
MSDS 材料安全数据表: 47x,4712,4731,5700,5702,616,484 MSDS
标准包装: 1
系列: 470
胶带类型: 电镀
胶合剂: 橡胶
背衬,载体: 乙烯基
厚度: 0.0071"(7.1 mils,0.180mm)
厚度 - 胶合剂: 0.0008"(0.8 mils,0.021mm)
厚度 - 背胶,载体,衬垫: 0.0063"(6.3 mils,0.160mm)
宽: 12.00"(304.80mm)1'
长度: 15'(4.6m)5 码
颜色: 棕褐
使用: 遮蔽,保护,密封
温度范围: 170°F(77°C)
包装: 散装
Electroplating Tape
470 ? 470L
Technical Data
Product Description
Product Construction
February, 2011
3M? Electroplating Tape 470 is a conformable and abrasion-resistant vinyl tape
with excellent resistance to most chemicals used in typical electroplating processes.
3M? Electroplating Tape 470L is a linered version of 3M vinyl tape 470 that may
be used for die-cutting or large area applications.
Standard
Backing
Pigmented
Adhesive
Rubber
Liner
Tape 470 - none
Color
Tan
Roll Length
36 yds. (33 m)
vinyl
Tape 470L - white paper
Typical Physical
Properties
Note: The following technical information and data should be considered representative
or typical only and should not be used for specification purposes.
ASTM Test Method
Adhesion to Steel:
Tensile Strength at Break:
Elongation at Break:
Backing Thickness:
Total Tape Thickness (without liner) :
Liner Thickness:
Temperature Use Range:
37 oz./in. width (40.4 N/100 mm)
20 lbs./in. width (350 N/100 mm)
180%
6.3 mils (0.16 mm)
7.1 mils (0.18 mm)
6.1 mils (0.15 mm)
Up to 250°F (121°C)
D-3330
D-3759
D-3759
D-3652
D-3652
D-3652
Features
? Excellent resistance to most chemicals used in typical electroplating operations.
? Prolonged exposure to elevated temperatures (above 250°F/121°C) and hot
caustics may cause weakening of the adhesive bond.
? Can be qualified to meet Federal Specification HH-T-0025 (GSA-FSS)
Ammendment 2.
? Resists most common solvents, care should be taken to avoid ketones, chlorinated
hydrocarbons, and esters, found in lacquer thinners, degreasers, paint strippers,
etc., which may cause the backing to swell or curl.
? Vinyl backing is conformable
? Backing accepts marker ink and is printable in using the thermal transfer process.
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