参数资料
型号: 1206SFS500F/32-2
厂商: TE Connectivity
文件页数: 24/28页
文件大小: 0K
描述: FUSE 5.0A 32V SLOW SMD 1206
产品培训模块: Circuit Protection Products
产品目录绘图: 1206S(FF,FH,FS) Series Footprint
1206S(FH,FS) Series
标准包装: 1
系列: 1206SFS
保险丝类型: 板安装(不包括管筒式)
额定电流: 5A
额定电压 - DC: 32V
响应时间: 慢速
封装/外壳: 1206(3216 公制)
安装类型: 表面贴装
尺寸/尺寸: 0.126" L x 0.063" W x 0.046" H(3.20mm x 1.60mm x 1.17mm)
额定电压时的断路容量: 50A
熔化 I²t: 5.3
批准: UL
工作温度: -55°C ~ 125°C
包装: *
DC 抗冷流: 0.016 欧姆
产品目录页面: 2405 (CN2011-ZH PDF)
其它名称: 1206SFS500F/32DKR
Table F4 Packaging Information for All Fuses
Reel Quantity
Carrier
Reels per Outside
Outside Shipment
Size
0402(1005)
0603(1608)
0603SFV(1608)
1206(3216)
2410(6125)
(pcs)
10,000
4,000
6,000
3,000
2,000
Reel Diameter
178mm white plastic
178mm white plastic
178mm white plastic
178mm white plastic
178mm white plastic
Reel Width
9.0 ± 0.5mm
9.0 ± 0.5mm
9.0 ± 0.5mm
9.0 ± 0.5mm
13.4 ± 0.5mm
Tape Size
8.00 ± 0.10mm
8.00 ± 0.10mm
8.00 ± 0.10mm
8.00 ± 0.10mm
12.00 ± 0.10mm
Tape Type
Paper
Paper
Paper
Plastic
Plastic
Shipment Box
5
5
5
5
4
Boxes per Overpack
1 to 10
1 to 10
1 to 10
1 to 10
1 to 10
at
Figure F2 Recommended Soldering Temperature Profile for All Fuses
tp p
T L to o Tp
Tp
Ramp up
Critical Zone
t
T L
T Ts s MAX
T Ts s MIN N
ts s
Preheat
t L
Ramp down
25
Reflow Profile
Classification Reflow Profiles
t 25 ?C to Peak
Time
Profile Feature
Average ramp up rate (Ts MAX to Tp)
Preheat
? Temperature min. (Ts MIN )
1206/0603/0402
3°C/second max.
150°C
2410
3°C/second max.
150°C
11
? Temperature max. (Ts MAX )
? Time (ts MIN to ts MAX )
200°C
60-180 seconds
200°C
40-100 seconds
Time maintained above:
? Temperature (T L )
? Time (t L )
Peak/Classification temperature (Tp)
Time within 5°C of actual peak temperature
Time (tp)
From 25°C to preheating (150°C)
Ramp down rate
217°C
60-150 seconds
260°C max.
20-40 seconds
8 minutes max.
4°C/second max.
200°C
30-90 seconds
250°C max.
30-40 seconds
40-100 seconds
Natural cooling
Recommended conditions for hand soldering:
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.
98
RoHS Compliant, ELV Compliant
HF Halogen Free
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