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参数资料
| 型号： | 1338-31DCGI |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟/数据恢复及定时提取 |
| 英文描述： | 1 TIMER(S), REAL TIME CLOCK, PDSO8 |
| 封装： | 0.150 INCH, ROHS COMPLIANT, SOIC-8 |
| 文件页数： | 17/23页 |
| 文件大小： | 255K |
| 代理商： | 1338-31DCGI |
IDT1338
REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM
RTC
IDT REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 3
IDT1338
REV M 092211
Typical Operating Circuit
Detailed Description
The following sections discuss in detail the Oscillator block,
Power Control block, Clock/Calendar Register Block and
Serial I2C block.
Oscillator Block
Selection of the right crystal, correct load capacitance and
careful PCB layout are important for a stable crystal
oscillator. Due to the optimization for the lowest possible
current in the design for these oscillators, losses caused by
parasitic currents can have a significant impact on the
overall oscillator performance. Extra care needs to be taken
to maintain a certain quality and cleanliness of the PCB.
Crystal Selection
The key parameters when selecting a 32 kHz crystal to work
with IDT1338 RTC are:
Recommended Load Capacitance
Crystal Effective Series Resistance (ESR)
Frequency Tolerance
Effective Load Capacitance
Please see diagram below for effective load capacitance
calculation. The effective load capacitance (CL) should
match the recommended load capacitance of the crystal in
order for the crystal to oscillate at its specified parallel
resonant frequency with 0ppm frequency error.
In the above figure, X1 and X2 are the crystal pins of our
device. Cin1 and Cin2 are the internal capacitors which
include the X1 and X2 pin capacitance. Cex1 and Cex2 are
the external capacitors that are needed to tune the crystal
frequency. Ct1 and Ct2 are the PCB trace capacitances
between the crystal and the device pins. CS is the shunt
capacitance of the crystal (as specified in the crystal
manufacturer's datasheet or measured using a network
analyzer).
Note: IDT1338CSRI integrates a standard 32.768 kHz
crystal in the package and contributes an additional
frequency error of 10ppm at nominal VCC (+3.3 V) and
TA=+25°C.
CPU
X1
X2
VCC
SQW/OUT
VBAT
GND
SDA
SCL
CRYSTAL
IDT1338
+
-
VCC
2k
VCC
10k
相关PDF资料 |
PDF描述 |
|---|---|
| 1339-2DVGI | 1 TIMER(S), REAL TIME CLOCK, PDSO8 |
| 1339-31DCGI8 | 1 TIMER(S), REAL TIME CLOCK, PDSO8 |
| 13715-806-XTD | 300 MHz, OTHER CLOCK GENERATOR, PDSO16 |
| 1374610-3 | INTERCONNECTION DEVICE |
| 1376137-1 | POWER CONNECTOR |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 1338-31DCGI8 | 功能描述:实时时钟 .9RTC BASE RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| 1338-31DVGI | 功能描述:实时时钟 .9RTC BASE RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| 1338-31DVGI8 | 功能描述:实时时钟 .9RTC BASE RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| 1338320-1 | 制造商:TE Connectivity 功能描述:GUARD, END FEED - Bulk |
| 1338320-2 | 功能描述:GUARD END FEED 制造商:te connectivity amp connectors 系列:* 零件状态:在售 标准包装:1 |
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