参数资料
型号: 1470250-1
厂商: TE Connectivity
文件页数: 3/8页
文件大小: 0K
描述: CONN HD D-SUB RECPT R/A 15POS
3D 型号: 1470250-1.pdf
标准包装: 1,000
系列: AMPLIMITE HD-22
连接器类型: D-Sub,高密度
位置数: 15
行数: 3
外壳尺寸,连接器布局: 1(DE,E)高密度
触点类型:: 信号
连接器类型: 插座,母形插口
安装类型: 通孔,直角
法兰特点: 配接侧;母型螺钉锁(4-40)
端子: 焊接
特点: 板锁
外壳材料,表面处理: 钢,镀镍
触点表面涂层:
触点涂层厚度: 闪光
工作温度: -55°C ~ 105°C
额定电压: 125V
额定电流: 2A
体座材料: 热塑塑胶
颜色:
108-1092
Test Description
Physical shock.
Mating force.
Unmating force.
Durability.
Solderability.
Requirement
No discontinuities greater than 1
microsecond.
See Note.
Force in pounds maximum.
Grounding
Indents
Size Positions W/O With
1 15 5.6 33
2 26 9.8 38
3 44 16.5 46
4 62 23.3 52
5 78 29.3 58
Force in pounds maximum.
Grounding
Indents
Size Positions W/O With
1 15 5.6 33
2 26 9.8 38
3 44 16.5 46
4 62 23.3 52
5 78 29.3 58
See Note.
Solderable area shall have
minimum of 95% solder coverage.
Procedure
TE Spec 109-26-1.
Subject mated connectors to 50 G's
half-sine shock pulses of 11
milliseconds duration. 3 shocks in
each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 4.
TE Spec 109-42, Condition A.
Measure force necessary to mate
connector assemblies at rate of 1
inch per minute.
TE Spec 109-42, Condition A.
Measure force necessary to
unmate connector assemblies at
rate of 1 inch per minute.
TE Spec 109-27.
Mate and unmate connector
assemblies for 100 cycles for gold
flash and 500 cycles for 30 μ in gold
plating at maximum rate of 200
cycles per hour.
TE Spec 109-11-1.
Subject contacts to solderability for
connectors with tin-lead plated
solder tails.
TE Spec 109-11-11.
Subject contacts to solderability for
connectors with lead-free tin plated
soldertails.
ENVIRONMENTAL
Thermal shock.
See Note.
TE Spec 109-22.
Subject mated connectors to 100
cycles between -55 and 105°C for
regular housings and -55 and
130°C for high temperature
housings.
Figure 1 (continued)
Rev F
3 of 8
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