参数资料
型号: 159900F00000G
厂商: Aavid Thermalloy
文件页数: 25/116页
文件大小: 0K
描述: THERMAL EPOXY
MSDS 材料安全数据表: 1500 Hardener
1500 Resin
标准包装: 1
系列: Ther-O-Bond 1500
类型: 树脂和硬化剂
尺寸/尺寸: 1 夸脱瓶装
其它名称: 000111
16
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SINKS
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GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
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Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Heat sinks for plastic BGA packages
IC Pkg. Size (mm) IC Pkg. Style
Part Number
“W” (mm)
“L” (mm)
“H” (mm)
θn2
θf 3
Finish
Tape code1
10 x 10
Plastic
375324B00035G
10.20
71.40
21.20
Black anodize
35
15 x 15
Plastic
375424B00034G
15.20
6.40
62.50
17.60
Black anodize
34
23 x 23
Plastic
374024B00035G
23.00
10.00
40.00
11.69
Black anodize
35
23 x 23
Plastic
374124B00035G
23.00
18.00
23.40
7.39
Black anodize
35
23 x 23
Plastic
374224B00035G
23.00
25.00
19.70
6.370
Black anodize
35
25 x 25
Plastic
335224B00034G
25.00
9.90
34.00
10.39
Black anodize
34
27 x 27
Plastic
374324B00035G
27.00
10.00
30.60
9.35
Black anodize
35
27 x 27
Plastic
374424B00035G
27.00
18.00
20.30
6.46
Black anodize
35
27 x 27
Plastic
374524B00035G
27.00
25.00
16.50
5.47
Black anodize
35
28 x 28
Plastic
373024B00034G
27.90
8.90
33.30
10.00
Black anodize
34
28 x 28
Plastic
2327B-CP50G
27.90
28.10
15.20
23.40
7.43
Black anodize
34
31 x 31
Plastic
335824B00034G
30.00
9.40
29.40
9.11
Black anodize
34
35 x 35
Plastic
371824B00034G
35.00
7.00
31.90
9.67
Black anodize
34
35 x 35
Plastic
374624B00035G
35.00
10.00
23.40
7.55
Black anodize
35
35 x 35
Plastic
374724B00035G
35.00
18.00
15.30
5.15
Black anodize
35
35 x 35
Plastic
374824B00035G
35.00
25.00
12.00
4.27
Black anodize
35
35 x 35
Plastic
372024B00034G
35.00
27.90
11.90
4.28
Black anodize
34
40 x 40
Plastic
374924B00035G
40.00
10.00
20.30
6.46
Black anodize
35
40 x 40
Plastic
364424B00034G
40.10
40.00
11.40
18.40
6.02
Black anodize
34
40 x 40
Plastic
375024B00035G
40.00
18.00
12.20
4.34
Black anodize
35
40 x 40
Plastic
375124B00035G
40.00
25.00
10.30
3.83
Black anodize
35
BGA–Tape Attachment
Pressure sensitive, thermally conductive adhesive tape
easily and reliably bonds a heat sink to an integrated
circuit package. Tapes provide high thermal conductiv-
ity and exceptional bonding properties. Adhesives are
formulated for plastic and metal/ceramic packages.
"L"
"H"
"W"
Material: Aluminum
ORDERING INFORMATION
1. For tape specifications see page 88
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
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