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参数资料
| 型号： | 16047 |
| 英文描述： | FASTcard 2? 27.8KB (PDF) |
| 中文描述： | FASTcard 2？ 27.8KB（PDF格式） |
| 文件页数： | 2/3页 |
| 文件大小： | 27K |
| 代理商： | 16047 |
AMD
P R E L I M I N A R Y
5-4
The SUPERNET 2 Family for FDDI 1994 Data Book
MP Card
DAS Card
16047B-1
Optical
Data Link
Optical
Data Link
32Kx8 SRAM
PROM
XTAL
Am79C830A
FORMAC
Plus
Am79C864
PLC
Am79C864
PLC
Advanced Micro Devices
FASTcard 2 DAS
Primary-In
Secondary-Out
Secondary-In
Primary-Out
External Interface
PDR
PDT
PDR
PDT
Optical
Data Link
Optical
Data Link
Advanced Micro Devices
FASTcard 2 Master Port
External
Interface
Optical
Data
Link
Optical
Data
Link
Optical
Data
Link
Optical
Data
Link
PDR
PDT
PDR
PDT
PDR
PDT
PDR
PDT
Optical
Data Link
Optical
Data Link
Optical
Data Link
Optical
Data Link
Am79C864
PLC
Am79C864
PLC
Am79C864
PLC
Am79C864
PLC
HARDWARE
The FASTcard 2 hardware consists of two main sec-
tions; the FDDI station logic and the associated inter-
face logic. The FDDI station logic consists of the
SUPERNET 2 chip set, the buffer memory, and the fiber
optic transmitter/receiver. The chip set performs the
buffer memory management tasks in addition to the
MAC and PHY layer functions. The buffer memory on
the FASTcard 2 hardware consists of 128K bytes organ-
ized as 32K x 36 bits. Buffer memory control logic pro-
vides the host CPU with direct access to the FDDI buffer
memory via the host DMA interface of the FORMAC
Plus (Am79C830A).
The interface logic consists of the AT bus interface, the
host-buffer memory interface, counter and interrupt
logic, Connection Management (CMT) logic, and FDDI
configuration hooks and control logic. The CMT logic is
responsible for gathering connection statistics of the
network to report them to the station. The DAS board
provides interface signals to additional MP cards when
constructing a concentrator. The DAS board makes use
of the AT’s processor as the host and node controller.
相关PDF资料 |
PDF描述 |
|---|---|
| 1608-015 | 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 1608-018 | 1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 1608-033K | 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 1608-047K | 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 1608-068J | 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 160-4700-FBW | 制造商:RCD Components Inc 功能描述:Res Wirewound 470 Ohm 1% 5W ±20ppm/°C Conformal Hi Temp Sil AXL Thru-Hole Bulk |
| 160-470-JBW | 制造商:RCD Components Inc 功能描述:WW RES 5W AXIAL 47 OHM 5% BULK 制造商:RCD Components Inc 功能描述:Res Wirewound 47 Ohm 5% 5W ±20ppm/°C Conformal AXL Bulk |
| 160-470JS | 功能描述:固定电感器 .047uH 5% .085ohm Chip SMT Inductor RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| 160-470JS BULK 50 | 制造商:API Delevan 功能描述:INDUCTOR .047 UH 5% SMD |
| 160-470KS | 功能描述:固定电感器 .047uH 10% .085ohm Chip SMT Inductor RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
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