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| 型号： | 1673998 |
| 英文描述： | SILICONE ELASTOMER SYLGARD 1.1KG |
| 中文描述： | 硅橡胶SYLGARD 1.1公斤 |
| 文件页数： | 3/8页 |
| 文件大小： | 117K |
| 代理商： | 1673998 |
Product
Potential Uses
Application Methods
Cure1,2
Silicone Encapsulants
Sylgard
160 Silicone
Elastomer
General potting applications: power
supplies, connectors, sensors, industrial
controls, transformers, ampliers, high
voltage resistor packs, relays
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in
a 1:1 ratio by weight or volume; automated
mixing and dispensing; manual mixing
24 hours at 25°C (77°F)
10 minutes at 100°C (212°F)
5 minutes at 150°C (302°F)
Sylgard 165 Silicone
Elastomer
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in
a 1:1 ratio by weight or volume; automated
mixing and dispensing
5 minutes at 25°C (77°F)
Sylgard 170 Silicone
Elastomer
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in
a 1:1 ratio by weight or volume; automated
mixing and dispensing; manual mixing
24 hours at 25°C (77°F)
20 minutes at 70°C (158°F)
15 minutes at 85°C (185°F)
10 minutes at 100°C (212°F)
Sylgard 170 Fast
Cure Silicone
Elastomer
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in
a 1:1 ratio by weight or volume; automated
mixing and dispensing
10 minutes at 25°C (77°F)
Dow Corning
96-082 A & B
Encapsulant
Applications requiring the thorough
impregnation possible only with a very low
viscosity resin
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in
a 1:1 ratio by weight or volume; automated
mixing and dispensing; manual mixing
30 minutes at 150°C (302°F)
Sylgard 182 Silicone
Elastomer
General potting applications: power
supplies, connectors, sensors, industrial
controls, transformers, ampliers, high
voltage resistor packs, relays; adhesive/
encapsulant for solar cells; adhesive
handling beam lead integrated circuits
during processing
Supplied as two-part liquid component kits
comprised of Base/Curing Agent to be
mixed in a 10:1 ratio by weight or volume;
automated mixing and dispensing; manual
mixing
45 minutes at 100°C (212°F)
20 minutes at 125°C (257°F)
10 minutes at 150°C (302°F)
Sylgard 184 Silicone
Elastomer
~48 hours at room temp
45 minutes at 100°C (212°F)
20 minutes at 125°C (257°F)
10 minutes at 150°C (302°F)
Sylgard 186 Silicone
Elastomer
~48 hours at room temp
30 minutes at 100°C (212°F)
15 minutes at 150°C (302°F)
Dow Corning
3-6121 Encapsulating
Elastomer
Low-temperature encapsulating
applications; optical applications requiring
high refractive index
~48 hours at room temp
20 minutes at 100°C (212°F)
10 minutes at 150°C (302°F)
Primerless Silicone Encapsulants
Sylgard 275 Silicone
Elastomer
Encapsulating applications requiring good
primerless adhesion and lower heat cure
temperatures
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in
a 1:1 ratio by weight or volume; automated
or manual mixing and dispensing can be used
45 minutes at room temp
<5 minutes at 80°C (176°F)
Dow Corning
3-6642 Thermally
Conductive Adhesive
Encapsulating applications requiring high
thermal conductivity and/or good
primerless adhesion
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in
a 1:1 ratio by weight or volume; automated
or manual mixing and dispensing can be used
Note: For full shelf life, product must be
refrigerated during storage.
20 minutes at 100°C (212°F)
5 minutes at 150°C (302°F)
Dow Corning
3-8264 Primerless
Silicone Adhesive
Encapsulating applications requiring good
primerless adhesion and lower heat cure
temperatures
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in
a 1:1 ratio by weight or volume; automated
or manual mixing and dispensing can be used
150 minutes at 70°C (158°F)
30 minutes at 115°C (239°F)
Dow Corning 567
Primerless Silicone
Encapsulant
Low cost primerless adhesion
encapsulation applications
Supplied as two-part liquid component kits
comprised of Part A/Part B to be mixed in
a 1:1 ratio by weight or volume; automated
or manual mixing and dispensing can be used
90 minutes at 100°C (212°F)
60 minutes at 125°C (257°F)
15 minutes at 150°C (302°F)
1These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary
slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended
to conrm adequate cure for your application.
2For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
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