参数资料
型号: 1812J250824MXBE03
厂商: SYFER TECHNOLOGY LTD
元件分类: 数据传输滤波器
英文描述: 1 FUNCTIONS, 25 V, FEED THROUGH CAPACITOR
封装: EIA STD PACKAGE SIZE 0603, CERAMIC PACKAGE-3
文件页数: 1/4页
文件大小: 194K
代理商: 1812J250824MXBE03
notes
1. For details of ordering see page 62
2. For soldering and installation information see page 69
* The 0603 chip size is a development item that will be available during the life
of this catalogue. All technical information should be considered provisional
and subject to change.
Integrated Passive Components
Balanced Line EMI Chip
BLC
The Syfer Balanced Line Chip is a 3 terminal EMI chip device. The
revolutionary design provides simultaneous line-to-line and line-to-
ground filtering, using a single ceramic chip. In this way, differential
and common mode filtering are provided in one device. Capable of
replacing 2 or more conventional devices, it is ideal for balanced lines,
twisted pairs and dc motors, in automotive, audio, sensor and other
applications.
These filters can prove invaluable in meeting stringent EMC demands
particularly in automotive applications.
Specifications
W
T
L2
L
L1
Chip
Size
L
W
T
L1
L2
0603*
1.6±0.2 (0.063±0.008)
0.8±0.2 (0.03±0.008)
0.5±0.15 (0.02±0.006)
0.3±0.2 (0.012±0.008)
0.2±0.1 (0.008±0.004)
0805
2.0±0.3 (0.08±0.012)
1.25±0.2 (0.05±0.008)
1.0±0.15 (0.04±0.006)
0.5±0.25 (0.02±0.01)
0.3±0.15 (0.012±0.006)
1206
3.2±0.3 (0.126±0.012)
1.60±0.2 (0.063±0.008)
1.1±0.2 (0.43±0.008)
0.95±0.3 (0.037±0.012)
0.5±0.25 (0.02±0.01)
1410
3.6±0.3 (0.14±0.012)
2.5±0.3 (0.1±0.012)
2 max. (0.08 max.)
1.20±0.3 (0.047±0.012)
0.5±0.25 (0.02±0.01)
1812
4.5±0.35 (0.18±0.14)
3.2±0.3 (0.126±0.012)
2 max. (0.08 max.)
1.5±0.35 (0.6±0.14)
0.5±0.25 (0.02±0.01)
2220
5.7±0.4 (0.22±0.016)
5.0±0.4 (0.2±0.016)
2.5 max. (0.1 max.)
2.25±0.4 (0.09±0.016)
0.75±0.25 (0.03±0.01)
Dielectric
X7R or C0G
Electrical Configuration
Multiple capacitance
Capacitance Measurement
At 1000hr point
Typical Capacitance Matching Better than 5%
Temperature Rating
-55°C to 125°C
Dielectric Withstand Volage
2.5 x Rated Volts for 5 secs.
Charging current limited to 50mA Max.
Insulation Resistance
10,000 Mohms Min
Termination Material
Nickel Barrier
Advantages
Replaces 2 or 3 capacitors with one device
Matched capacitance line to ground on both lines
Low inductance due to cancellation effect
Capacitance line to line
Differential and common mode attenuation
Effects of temperature and voltage variation eliminated
Effect of ageing equal on both lines
High current capability
Applications
Balanced lines
Twisted pairs
EMI Suppression on DC motors
Sensor/transducer applications
Wireless communications
Audio
GROUND
AA
BB
C1
C2
INPUT 1
INPUT 2
A
B
D
C
Recommended Solder Lands
220nF
100nF
47nF
22nF
10nF
4.7nF
2.2nF
1nF
470pF
220pF
100pF
47pF
22pF
0
20
40
60
80
0.1
1
10
100
1000
Insertion Loss Characteristics (common mode)
Typical 50 ohm system
Insertion
Loss
(dB)
Frequency (MHz)
Dimensions mm (inches)
Chip Size
A
B
C
D
0603* 0.6 (0.024) 0.6 (0.024)
0.4 (0.016)
0.2 (0.008)
0805
0.95 (0.037) 0.9 (0.035)
0.3 (0.012)
0.4 (0.016)
1206
1.2 (0.047) 0.9 (0.035)
0.6 (0.024)
0.8 (0.03)
1410
2.05 (0.08)
1.0 (0.04)
0.7 (0.028)
0.9 (0.035)
1812
2.65 (0.104) 1.4 (0.055)
0.8 (0.03)
1.4 (0.055)
2220
4.15 (0.163) 1.4 (0.055)
1.2 (0.047)
1.8 (0.071)
59
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