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参数资料
| 型号： | 1KIS004-04MG |
| 厂商： | ADVANCED INTERCONNECTIONS CORP |
| 元件分类： | 插座 |
| 英文描述： | PGA4, IC SOCKET |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/2页 |
| 文件大小： | 256K |
| 代理商： | 1KIS004-04MG |
PGA Sockets
Low Insertion Force PGA Sockets
.100/(2.54mm) Standard Grid
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Footprint Dash #
If Applicable
*
1 RIS
068 - 04 M G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
KIS - Peel-A-Way
FIS - FR-4
RIS - Hi-Temp Molded LCP
Number of Pins
004 to 484
*Footprints available online
See options on next page
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
RoHS Compliant:
G - Gold
T - Tin/Lead
Footprint Dash #
If Applicable
*
1 ESX 503 - 234
M
G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant Insulators:
KSX - Peel-A-Way
ESX - New Hi-Temp Molded
CSX - Hi-Temp Molded s
Number of Pins
004 to 2209
*Footprints available online or
in separate booklet.
See options
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead s
RoHS Compliant:
G - Gold
T - Tin/Lead s
s
= Not RoHS Compliant
RIS replaces HCIS, HCS, CIS, and CS. KIS replaces KS. FIS replaces FS.
Description: FR-4 (FIS)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Description: Peel-A-Way (KIS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description: Molded (RIS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Table of Models
Options
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
?
.062
(1.57)
PC Board
?
.095
(2.41)
PC Board
Features:
Low insertion force (1 oz. average
per pin).
Screw-machined terminals with
multiple finger contacts for
reliability.
Closed bottom terminal for 100%
anti-wicking of solder.
Tapered entry for ease of
insertion.
Custom designs available.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Tape Seal - add 3M to end of part number
Removable tape seal protects plated contact in harsh environments
Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
Spray flux without contaminating contact area
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
Polyimide
Film
.005
(.13)
How To Order
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