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参数资料
| 型号： | 1SMA5924BT3G |
| 厂商： | ON Semiconductor |
| 文件页数： | 1/5页 |
| 文件大小： | 0K |
| 描述： | DIODE ZENER 9.1V 1.5W SMA |
| 标准包装： | 5,000 |
| 电压 - 齐纳（标称）(Vz)： | 9.1V |
| 电压 - 在 If 时为正向 (Vf)（最大）： | 1.5V @ 200mA |
| 电流 - 在 Vr 时反向漏电： | 2.5µA @ 7V |
| 容差： | ±5% |
| 功率 - 最大： | 500mW |
| 阻抗（最大）(Zzt)： | 4 欧姆 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | DO-214AC，SMA |
| 供应商设备封装： | SMA |
| 包装： | 带卷 (TR) |
| 工作温度： | -65°C ~ 150°C |
1SMA59xxBT3G Series,
SZ1SMA59xxBT3G Series
1.5 Watt Plastic
Surface Mount
Zener Voltage Regulators
This complete new line of 1.5 Watt Zener Diodes offers the
following advantages.
Features
http://onsemi.com
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?
?
?
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Standard Zener Breakdown Voltage Range ? 3.3 V to 68 V
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Flat Handling Surface for Accurate Placement
Package Design for Top Slide or Bottom Circuit Board Mounting
Low Profile Package
SMA
CASE 403D
PLASTIC
STYLE 1
?
?
Ideal Replacement for MELF Packages
AEC ? Q101 Qualified and PPAP Capable ? SZ1SMA59xxBT3G
CATHODE
ANODE
?
?
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb ? Free Packages are Available*
MARKING DIAGRAM
Mechanical Characteristics:
CASE: Void-free, transfer-molded plastic
FINISH: All external surfaces are corrosion resistant with readily
8xxB
AYWW G
solderable leads
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260 ? C for 10 seconds
POLARITY: Cathode indicated by molded polarity notch or cathode
band
8xxB
A
Y
WW
G
= Device Code (Refer to page 2)
= Assembly Location
= Year
= Work Week
= Pb ? Free Package
FLAMMABILITY RATING: UL 94 V ? 0 @ 0.125 in
ORDERING INFORMATION
MAXIMUM RATINGS
Device
Package
Shipping ?
Rating
DC Power Dissipation @ T L = 75 ? C,
Measured Zero Lead Length (Note 1)
Derate above 75 ? C
Thermal Resistance, Junction ? to ? Lead
Symbol
P D
R q JL
Value
1.5
20
50
Unit
W
mW/ ? C
? C/W
1SMA59xxBT3G
SZ1SMA59xxBT3G
SMA
(Pb ? Free)
SMA
(Pb ? Free)
5,000 /
Tape & Reel
5,000 /
Tape & Reel
DC Power Dissipation @ T A = 25 ? C (Note 2) P D 0.5 W
Derate above 25 ? C 4.0 mW/ ? C
Thermal Resistance, Junction ? to ? Ambient R q JA 250 ? C/W
Operating and Storage Temperature Range T J , T stg ? 65 to ? C
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. 1 in square copper pad, FR ? 4 board.
2. FR ? 4 Board, using ON Semiconductor minimum recommended footprint.
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
? Semiconductor Components Industries, LLC, 2012
January, 2012 ? Rev. 8
1
Publication Order Number:
1SMA5913BT3/D
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