参数资料
| 型号： | 1SMB28CAT3G |
| 厂商： | ON Semiconductor |
| 文件页数： | 5/7页 |
| 文件大小： | 0K |
| 描述： | TVS 600W 28V BIDIRECT SMB |
| 产品目录绘图： | SMB 600 Watt Top SMB 600 Watt Side 1 SMB 600 Watt Side 2 |
| 标准包装： | 1 |
| 电压 - 反向隔离（标准值）： | 28V |
| 电压 - 击穿： | 31.1V |
| 功率（瓦特）： | 600W |
| 电极标记： | 双向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | DO-214AA，SMB |
| 供应商设备封装： | SMB |
| 包装： | 标准包装 |
| 其它名称： | 1SMB28CAT3GOSDKR |
1SMB10CAT3G Series, SZ1SMB10CAT3G Series
APPLICATION NOTES
Response Time
In most applications, the transient suppressor device is
placed in parallel with the equipment or component to be
protected. In this situation, there is a time delay associated
with the capacitance of the device and an overshoot
condition associated with the inductance of the device and
the inductance of the connection method. The capacitive
effect is of minor importance in the parallel protection
scheme because it only produces a time delay in the
transition from the operating voltage to the clamp voltage as
shown in Figure 5.
The inductive effects in the device are due to actual
turn-on time (time required for the device to go from zero
current to full current) and lead inductance. This inductive
effect produces an overshoot in the voltage across the
equipment or component being protected as shown in
Figure 6. Minimizing this overshoot is very important in the
application, since the main purpose for adding a transient
suppressor is to clamp voltage spikes. The SMB series have
a very good response time, typically < 1 ns and negligible
inductance. However, external inductive effects could
produce unacceptable overshoot. Proper circuit layout,
minimum lead lengths and placing the suppressor device as
close as possible to the equipment or components to be
protected will minimize this overshoot.
Some input impedance represented by Z in is essential to
prevent overstress of the protection device. This impedance
should be as high as possible, without restricting the circuit
operation.
Duty Cycle Derating
The data of Figure 1 applies for non-repetitive conditions
and at a lead temperature of 25 ? C. If the duty cycle increases,
the peak power must be reduced as indicated by the curves
of Figure 7. Average power must be derated as the lead or
ambient temperature rises above 25 ? C. The average power
derating curve normally given on data sheets may be
normalized and used for this purpose.
At first glance the derating curves of Figure 7 appear to be
in error as the 10 ms pulse has a higher derating factor than
the 10 m s pulse. However, when the derating factor for a
given pulse of Figure 7 is multiplied by the peak power value
of Figure 1 for the same pulse, the results follow the
expected trend.
V
V in (TRANSIENT)
V
OVERSHOOT DUE TO
INDUCTIVE EFFECTS
V in (TRANSIENT)
V L
V L
V in
t d
t D = TIME DELAY DUE TO CAPACITIVE EFFECT
Figure 5.
1
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
t
Figure 6.
PULSE WIDTH
10 ms
1 ms
100 m s
t
0.01
0.1 0.2
0.5
1
10 m s
2 5 10
20
50 100
D, DUTY CYCLE (%)
Figure 7. Typical Derating Factor for Duty Cycle
http://onsemi.com
5
相关PDF资料 |
PDF描述 |
|---|---|
| 208457064001031 | CONNECTOR RECEPT 32POS STR |
| 108577048001025 | CONNECTOR HEADER 48POS STR |
| 208458096001028 | CONNECTOR RECEPT 96POS R/A |
| 108483006003049 | CONNECTOR HEADER 6POS R/A |
| 108483024001049 | CONNECTOR HEADER 24POS STR |
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