参数资料
型号: 1SMB90AT3
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: TVS 600W 90V UNIDIRECT SMB
产品变化通告: Product Obsolescence 06/Oct/2006
标准包装: 2,500
电压 - 反向隔离(标准值): 90V
电压 - 击穿: 100V
功率(瓦特): 600W
电极标记: 单向
安装类型: 表面贴装
封装/外壳: DO-214AA,SMB
供应商设备封装: SMB
包装: 带卷 (TR)
1SMB5.0AT3G Series,
SZ1SMB5.0AT3G Series
600 Watt Peak Power Zener
Transient Voltage
Suppressors
Unidirectional
The SMB series is designed to protect voltage sensitive
components from high voltage, high energy transients. They have
excellent clamping capability, high surge capability, low zener
impedance and fast response time. The SMB series is supplied in
ON Semiconductor ’s exclusive, cost-effective, highly reliable
SURMETIC ? package and is ideally suited for use in
communication systems, automotive, numerical controls, process
controls, medical equipment, business machines, power supplies and
many other industrial/consumer applications.
Features
http://onsemi.com
PLASTIC SURFACE MOUNT
ZENER OVERVOLTAGE
TRANSIENT SUPPRESSORS
5.0 V ? 170 V,
600 W PEAK POWER
SMB
CASE 403A
PLASTIC
?
Working Peak Reverse Voltage Range ? 5.0 V to 170 V
?
?
Standard Zener Breakdown Voltage Range ? 6.7 V to 199 V
Peak Power ? 600 W @ 1.0 ms
Cathode
Anode
?
?
?
?
?
?
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Maximum Clamp Voltage @ Peak Pulse Current
Low Leakage < 5.0 m A Above 10 V
UL 497B for Isolated Loop Circuit Protection
Response Time is Typically < 1.0 ns
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC ? Q101 Qualified and
MARKING DIAGRAM
AYWW
xx G
G
?
PPAP Capable
Pb ? Free Packages are Available*
A
Y
WW
= Assembly Location
= Year
= Work Week
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
xx = Device Code (Refer to page 3)
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
260 ? C for 10 Seconds
LEADS: Modified L ? Bend providing more contact area to bond pads
POLARITY: Cathode indicated by polarity band
MOUNTING POSITION: Any
Device
1SMBxxxAT3G
SZ1SMBxxxAT3G
Package
SMB
(Pb ? Free)
SMB
(Pb ? Free)
Shipping ?
2,500 /
Tape & Reel
2,500 /
Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
? Semiconductor Components Industries, LLC, 2012
February, 2012 ? Rev. 13
1
Publication Order Number:
1SMB5.0AT3/D
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