参数资料
型号: 2-1437006-1
厂商: TE Connectivity
文件页数: 19/100页
文件大小: 0K
描述: CONN PLUG 26POS DIP .100
标准包装: 900
系列: AMP-Latch
连接器类型: 带状缆线
位置数: 26
间距: 0.100"(2.54mm)
行数: 2
行间距: 0.100"(2.54mm)
安装类型: 通孔
电缆端接: IDC
线规: 28 AWG,绞合;26-30 AWG,实心
特点: 馈通
触点表面涂层:
触点涂层厚度: 118.1µin(3.00µm)
颜色:
包装: 散装
加载位置的数目: 全部
Ribbon Cable Interconnect Solutions
Board-to-Board Vertical Receptacles and Headers
Product Facts
I Surface-mount
products for
parallel board-to-board
applications, as well as
right-angle board-to-board
and cable-to-board
applications
I High density .050 x .050
[1.27x1.27] centerline grid
I Three board-to-board stack
heights: .250 [6.35], .320
[8.13] and .390 [9.91]
I Non-protrusive metallic
holddowns
I Reliable dual beam
receptacle contacts for
redundant contact
I Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin plated on tails
I Compatible with standard
surface-mount processing
(VPR and IR)
I Receptacle and header allow
for drainage of
processing fluids
I Tape and reel packaging
available. Contact
TE for details
I Polarized header and
receptacle assemblies
I Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
I Recognized under the
Component Program of
Underwriters
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right-angle board-to-board
and cable-to-board
applications are also
possible, since the vertical
receptacles also mate with
non-latching right-angle
PC boards and allow
surface mounting to both
sides of the board. In
addition to providing
retention during processing,
the holddowns are soldered
during reflow and therefore
provide
long-term strain relief for
the solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
holddown characteristics
and packaging methods
result in a system that is
compatible with robotic
assembly.
The headers and receptacles
feature polarization to
prevent misalignment.
Three Board Stack Heights
Laboratories Inc.,
File No. E28476
I Certified by
Canadian Standards
Association
File No. LR7189
R
R
headers (page 24) and the
vertical headers also mate
with non-latching cable
connectors.
Available are double row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Receptacles are designed
to be compatible with
standard surface-mount
processes; IR (infrared) and
VPR (vapor phase reflow).
The surface-mount
connectors have been
designed so that
dimensioning, tolerances,
referenced datums,
.250±.006
[6.35±0.15]
.320±.006
[8.13±0.15]
Parallel board-to-board
stack heights of .250 [6.35],
.320 [8.13] and .390 [9.91]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
Non-Protrusive
Metallic Holddowns
.390±.006
[9.91±0.15]
holddowns are designed for
use in .062 [1.57] or thicker
19
Catalog 82012
Revised 4-12
www.te.com
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Dimensions are in inches
and millimeters unless
otherwise specified.
USA: +1 (800) 522-6752
Canada: +1 (905) 475-6222
Mexico/C. Am.: +52 (0) 55-1106-0800
Latin/S. Am.: +54 (0) 11-4733-2200
Germany: +49 (0) 6251-133-1999
UK: +44 (0) 800-267666
France: +33 (0) 1-3420-8686
Netherlands: +31 (0) 73-6246-999
China: +86 (0) 400-820-6015
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