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参数资料
| 型号： | 2-1640240-0 |
| 厂商： | Tyco Electronics |
| 元件分类： | 终端 |
| 英文描述： | Matrix Series Ball Grid Array (BGA) Sockets |
| 中文描述： | Matrix Series Ball Grid Array (BGA) Sockets |
| 文件页数： | 1/5页 |
| 文件大小： | 3796K |
| 代理商： | 2-1640240-0 |
DESCRIPTION
Tyco Electronics is pleased to announce
the Matrix Series of BGASockets utilizing
HXC 125 polymer. The sockets are fully
arrayed matrixes of contacts available on
0.80mm, 1.00mm, and 1.27mm pitch. The
solderless, compression mount HXC 125
contact system allows you to test a BGA
device without attaching it directly to the
board. The HXC 125 polymer provides
electrically transparent signal transfer.
APPLICATIONS
The HXC 125 polymer system provides
a highly conductive interconnect. This
proprietary material consists of a high
temperature polymer compound that has
been embedded with metalized
particles. The material is formed into
micro-contacts just 0.635mm in diameter
and less than 1mm high. The contacts
are held in a grid pattern by a thin
polyimide substrate. When mechanically
compressed, the contacts electrical
characteristics are optimized.
The unique design of the BGAsocket uses
an anti-overstress feature which protects
the contact and also provides a well for the
ball to rest in. This well acts as an
alignment feature which centers the BGA
ball to the HXC 125 polymer material.
Corner frames provide for gross alignment
of the package to the socket.
KEY FEATURES
Allows socketing of BGAdevices during
prototyping and development
Fully arrayed patterns available in
1.27mm, 1.00mm and 0.80mm.
Array sizes up to 40 x 40 (1.27mm), 50 x
50 (1.00mm) and 60 x 60 (0.80mm).
Unique corner frame design allows
for gross alignment of the package
to the socket
Accommodates multiple ball sizes
Developed for use in test, development
and production environments
Solderless, compression mount
HXC 125 polymer allows for easy
socket replacement
Matrix Series BGA Sockets
Featuring HXC Material System
No tooling or set up charges
Full array stops provide anti-overstress
protection and fine alignment
Compact design minimizes real
estate required
Multiple cycles
Sockets designed to accept JEDEC
standard BGA’s
Complete hardware kits available
Bolster plate provides support,
eliminating board bow
Spring plate provides even force
distribution of compression load
Single screw spring plate allows
for easy actuation
FOR MORE INFORMATION
Technical Support
Internet: http://www.tycoelectronics.com
USA: 1-800-522-6752
Canada: 1-905-470-4425
UK: 44-1908-574289
Japan: 81-44-844-8013
相关PDF资料 |
PDF描述 |
|---|---|
| 2-1640240-1 | Matrix Series Ball Grid Array (BGA) Sockets |
| 2-1640240-2 | Matrix Series Ball Grid Array (BGA) Sockets |
| 2-1640240-3 | Matrix Series Ball Grid Array (BGA) Sockets |
| 2-1640240-4 | Matrix Series Ball Grid Array (BGA) Sockets |
| 2-1640240-5 | Matrix Series Ball Grid Array (BGA) Sockets |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 2-1640240-4 | 制造商:TE Connectivity 功能描述:1521 POSITION BGA SOCKET ASSEM - Bulk |
| 2-1640240-9 | 制造商:TE Connectivity 功能描述:1936 POSITION BGA SOCKET ASSEM - Bulk |
| 2-1640320-8 | 制造商:TE Connectivity 功能描述:SOCKET ASSEMBLY, 1600 POS. - Bulk |
| 216-404 | 功能描述:罩类、盒类及壳类产品 Pg 16, Entry SealHP70/80/90/100 RoHS:否 制造商:Bud Industries 产品:Boxes 外部深度:6.35 mm 外部宽度:6.35 mm 外部高度:2.56 mm NEMA 额定值: IP 等级: 材料:Acrylonitrile Butadiene Styrene (ABS) 颜色:Red |
| 2-164043-1 | 功能描述:32P.IEC-F MALE CONN RoHS:是 类别:连接器，互连式 >> 背板 - DIN 41612 系列:Eurocard 标准包装:100 系列:8487 连接器类型:接头，公引脚 位置数:48 加载位置的数目:32 间距:0.100"（2.54mm） 行数:3 样式:F 程度，等级:1 安装类型:通孔，直角 端子:焊接 特点:- 触点表面涂层:金 触点涂层厚度:- 包装:散装 工作温度:-65°C ~ 125°C 额定电流:- 材料可燃性额定值:- 材料 - 绝缘体:聚碳酸脂，玻璃纤维增强型 配套产品:208487048005050-ND - CONNECTOR RECEPT 48POS STR208487048003029-ND - CONNECTOR RECEPT 48POS STR |
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