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参数资料
型号： 20-101-1028
厂商： Rabbit Semiconductor
文件页数： 3/172页
文件大小： 0K
描述： MODULE RABBITCORE RCM3750
标准包装： 1
系列： RabbitCore®
模块/板类型： MPU 核心模块
适用于相关产品： RCM3750
产品目录页面： 619 (CN2011-ZH PDF)
其它名称： 316-1110
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RabbitCore RCM3750
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The RCM3700 Prototyping Board comes with the basic components necessary to demon-
strate the operation of the RCM3750. Two LEDs (DS1 and DS2) are connected to PF6 and
PF7, and two switches (S1 and S2) are connected to PF4 and PB7 to demonstrate the inter-
face to the Rabbit 3000 microprocessor. Reset switch S3 is the hardware reset for the
RCM3750.
The RCM3700 Prototyping Board provides the user with RCM3750 connection points
brought out conveniently to labeled points at header J3 on the RCM3700 Prototyping Board.
Although header J3 is unstuffed, a 2 × 20 header is included in the bag of parts. RS-485 sig-
nals are available on shrouded header J1, and RS-232 signals (Serial Ports C, D, and E) are
available on header J2. A header strip at J2 allows you to connect a ribbon cable. A shrouded
header connector and wiring harness are included with the RCM3700 Development Kit parts
to help you access the RS-485 signals on shrouded header J1.
There is a 2.5" × 3" through-hole prototyping space available on the RCM3700 Prototyping
Board. The holes in the prototyping area are spaced at 0.1" (2.5 mm). +3.3 V, +5 V, and
GND traces run along both edges of the prototyping area for easy access. Small to medium
circuits can be prototyped using point-to-point wiring with 20 to 30 AWG wire between the
prototyping area, the +3.3 V, +5 V, and GND traces, and the surrounding area where sur-
face-mount components may be installed. Small holes are provided around the surface-
mounted components that may be installed around the prototyping area.
B.1.4.1 Adding Other Components
There are two sets of pads for 28-pin devices that can be used for surface-mount prototyp-
ing SOIC devices. (Although the adjacent sets of pads could accommodate up to a 56-pin
device, they do not allow for the overlap between two 28-pin devices.) There are also pads
that can be used for SMT resistors and capacitors in an 0805 SMT package. Each compo-
nent has every one of its pin pads connected to a hole in which a 30 AWG wire can be sol-
dered (standard wire-wrap wire can be soldered in for point-to-point wiring on the
RCM3700 Prototyping Board). Because the traces are very thin, carefully determine
which set of holes is connected to which surface-mount pad.
相关PDF资料
PDF描述
046232104015800+ CONN FFC/FPC 4POS 1MM VERT SMD
20-101-0454 MODULE RABBITCORE RCM2200
20-101-0405 MODULE RABBITCORE RCM2010
20-101-1093 RCM4110 RABBITCORE
20-101-0453 MODULE RABBITCORE RCM2300
相关代理商/技术参数
参数描述
20-101-1051 功能描述:模块化系统 - SOM RCM3365 CORE MODULE RoHS:否 制造商:Digi International 外观尺寸:ConnectCore 9P 处理器类型:ARM926EJ-S 频率:150 MHz 存储容量:8 MB, 16 MB 存储类型:NOR Flash, SDRAM 接口类型:I2C, SPI, UART 工作电源电压:3.3 V 最大工作温度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
20-101-1055 功能描述:模块化系统 - SOM RCM3375 RABBITCORE RoHS:否 制造商:Digi International 外观尺寸:ConnectCore 9P 处理器类型:ARM926EJ-S 频率:150 MHz 存储容量:8 MB, 16 MB 存储类型:NOR Flash, SDRAM 接口类型:I2C, SPI, UART 工作电源电压:3.3 V 最大工作温度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
20-101-1066 功能描述:模块化系统 - SOM RCM3720 PROTO RS232 RoHS:否 制造商:Digi International 外观尺寸:ConnectCore 9P 处理器类型:ARM926EJ-S 频率:150 MHz 存储容量:8 MB, 16 MB 存储类型:NOR Flash, SDRAM 接口类型:I2C, SPI, UART 工作电源电压:3.3 V 最大工作温度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
20-101-1067 功能描述:模块化系统 - SOM RCM3305 MODULE RoHS:否 制造商:Digi International 外观尺寸:ConnectCore 9P 处理器类型:ARM926EJ-S 频率:150 MHz 存储容量:8 MB, 16 MB 存储类型:NOR Flash, SDRAM 接口类型:I2C, SPI, UART 工作电源电压:3.3 V 最大工作温度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
20-101-1068 功能描述:模块化系统 - SOM RCM3315 MODULE RoHS:否 制造商:Digi International 外观尺寸:ConnectCore 9P 处理器类型:ARM926EJ-S 频率:150 MHz 存储容量:8 MB, 16 MB 存储类型:NOR Flash, SDRAM 接口类型:I2C, SPI, UART 工作电源电压:3.3 V 最大工作温度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
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