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参数资料
| 型号： | 2069838-5 |
| 厂商： | Tyco Electronics |
| 元件分类： | 插座 |
| 英文描述： | LGA Sockets |
| 中文描述： | LGA插座 |
| 文件页数： | 1/2页 |
| 文件大小： | 2497K |
| 代理商： | 2069838-5 |
TE Connectivity’s surface mount LGA socket was designed for use with Intel’s
Core i7
LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while
the top side provides a cantilever beam interface to the package. The integrated lever
mechanism (ILM) generates the Z-axis compression load. A robust bolster plate eliminates
PCB bowing during compression. The sockets have been validated to Intel Design Guides.
Introducing
Sockets and Hardware for LGA 1156 Processors
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 2069838-5 | 制造商:TE Connectivity 功能描述:Back Plate Kits 制造商:TE Connectivity 功能描述:BACK PLATE KITS |
| 2069838-7 | 功能描述:IC 与器件插座 2069965-3 Socket Assembly LGA RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 2069838-9 | 功能描述:IC 与器件插座 2069838-9 ILM/Backplate Kit RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 2069905-1 | 制造商:TE Connectivity 功能描述:GIC 2.5 W PLUG HSG 14P NATURAL - Bulk 制造商:TE CONNECTIVITY 功能描述:GIC 2.5 W PLUG HSG 14P NATURAL |
| 2069906-1 | 制造商:TE Connectivity 功能描述:GIC 2.5 W CAP HSG 14P NATURAL - Bulk 制造商:TE CONNECTIVITY 功能描述:GIC 2.5 W CAP HSG 14P NATURAL |
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