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参数资料
| 型号： | 22921C1 |
| 英文描述： | Migrating between Flash Device Densities |
| 中文描述： | 迁移之间的Flash器件密度 |
| 文件页数： | 9/17页 |
| 文件大小： | 125K |
| 代理商： | 22921C1 |
16
Migrating Between Flash Device Densities
REVISION SUMMARY
Revision B (September 10, 1999)
Added the ball grid array column to both FBGA
diagrams.
Revision C (October 5, 2000)
Globally changed process technology designators in
part number as required to reflect current product
offerings.
Added 1.8 V Am29DS simultaneous read/write devices
to 48-pin TSOP illustration. Added 40-pin to 48-pin mi-
gration to 40-pin TSOP illustration. Added 1.8 V
Am29SL and Am29DS devices to 48-/63-ball FBGA
illustration.
Added illustrations for 47- & 48-
Ball FBGA, Am29BDS devices, 44-pin SO to 56-pin SO
3 V devices, and 56-pin SO: 3 V burst mode devices.
Revision C+1 (November 30, 2000)
Updated the following two diagrams to include VIO for
Am29LV065 devices:
40-Pin & 40- to 48-Pin TSOP: 3 V x8-only Devices
48- or 63-Ball FBGA: 3 V X8-only Devices
Trademarks
Copyright 2000 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 229-2-1R1..00372625 | 制造商:Sensata Technologies 功能描述:229-2-1R1..00372625 /Pole # 2 /Prod Family: 0209 |
| 229-2-1R1R..00372633 | 制造商:Sensata Technologies 功能描述:229-2-1R1R..00372633 /Pole # 2 /Prod Family: 0209 |
| 229-2-1REC4-25384-2 | 制造商:Airpax 功能描述:CIRCUIT BREAKER MAG-HYDR LEVER 制造商:Sensata Technologies 功能描述:229-2-1REC4-25384-2 /Pole # 2 /Prod Family: 0209 |
| 229-2-1REC4-28249-1 | 制造商:Sensata Technologies 功能描述:2 Pole |
| 229-2-1REC4-28249-2 | 制造商:Sensata Technologies 功能描述:1 Pole |
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