参数资料
型号: 24AA00-I/ST
厂商: Microchip Technology
文件页数: 12/24页
文件大小: 0K
描述: IC EEPROM 128BIT 400KHZ 8TSSOP
产品培训模块: I2C Serial EEPROM
标准包装: 100
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 128(16 x 8)
速度: 100kHz,400kHz
接口: I²C,2 线串口
电源电压: 1.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 管件
产品目录页面: 1443 (CN2011-ZH PDF)
24AA00/24LC00/24C00
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
2
3
A
D
A2
E
A1
b1
b
e
L
Units
e B
INCHES
c
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
.100 BSC
MAX
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
A
A2
A1
E
E1
D
L
c
b1
b
eB
.115
.015
.290
.240
.348
.115
.008
.040
.014
.130
.310
.250
.365
.130
.010
.060
.018
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS21178G-page 12
? 2007 Microchip Technology Inc.
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24AA00-OT 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:128 Bit I 2 C? Bus Serial EEPROM
24AA00-P 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:128 Bit I 2 C? Bus Serial EEPROM
24AA00-SN 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:128 Bit I 2 C? Bus Serial EEPROM
24AA00-ST 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:128 Bit I 2 C? Bus Serial EEPROM
24AA00T/OT 功能描述:电可擦除可编程只读存储器 16byte 128kb 1.8V RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8