参数资料
| 型号： | 24AA02/P |
| 厂商： | Microchip Technology |
| 文件页数： | 9/32页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 2KBIT 400KHZ 8DIP |
| 产品培训模块： | I2C Serial EEPROM |
| 标准包装： | 60 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 2K (256 x 8) |
| 速度： | 100kHz，400kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 1.7 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
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24AA02/24LC02B
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a write command (R/W = 0 ). If the device is still
busy with the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the master can then proceed with the next read or write
command. See Figure 7-1 for a flow diagram of this
operation.
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0 )?
Yes
Next
Operation
? 2009 Microchip Technology Inc.
No
DS21709J-page 9
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 24AA02SC-I/S16K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 1.8V SERIAL EE - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24AA02SC-I/W16K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 1.8V SERIAL EE - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24AA02SC-I/WF16K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 1.8V SERIAL EE - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24AA02SM | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1K/2K 1.8V I 2 C O Serial EEPROMs |
| 24AA02SN | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1K/2K 1.8V I 2 C O Serial EEPROMs |
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