参数资料
型号: 24C00T/OT
厂商: Microchip Technology
文件页数: 15/24页
文件大小: 0K
描述: IC EEPROM 128BIT 400KHZ SOT23-5
产品培训模块: I2C Serial EEPROM
标准包装: 3,000
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 128(16 x 8)
速度: 400kHz
接口: I²C,2 线串口
电源电压: 4.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
封装/外壳: SC-74A,SOT-753
供应商设备封装: SOT-23-5
包装: 带卷 (TR)
24AA00/24LC00/24C00
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
D
E
L
K
EXPOSED PAD
b
e
N
E2
NOTE 1
1
2
2
1
NOTE 1
D2
TOP VIEW
A
BOTTOM VIEW
A 3
A1
NOTE 2
Units
MILLIMETERS
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
0.50 BSC
MAX
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
A
A1
A3
D
E
D2
E2
b
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
0.90
0.02
0.20 REF
2.00 BSC
3.00 BSC
0.25
0.40
1.00
0.05
1.75
1.90
0.30
0.50
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
? 2007 Microchip Technology Inc.
DS21178G-page 15
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