参数资料
型号: 24LC00/P
厂商: Microchip Technology
文件页数: 14/24页
文件大小: 0K
描述: IC EEPROM 128BIT 400KHZ 8DIP
产品培训模块: I2C Serial EEPROM
标准包装: 60
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 128(16 x 8)
速度: 100kHz,400kHz
接口: I²C,2 线串口
电源电压: 2.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
封装/外壳: 8-DIP(0.300",7.62mm)
供应商设备封装: 8-PDIP
包装: 管件
产品目录页面: 1443 (CN2011-ZH PDF)
24AA00/24LC00/24C00
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
b
e
A
A1
A2
c
Units
L1
L
MILLIMETERS
φ
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
0.65 BSC
MAX
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
A
A2
A1
E
E1
D
L
L1
φ
c
0.80
0.05
4.30
2.90
0.45
0.09
1.00
6.40 BSC
4.40
3.00
0.60
1.00 REF
1.20
1.05
0.15
4.50
3.10
0.75
0.20
Lead Width b 0.19 – 0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-086B
DS21178G-page 14
? 2007 Microchip Technology Inc.
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