参数资料
型号: 24LC512-I/ST
厂商: Microchip Technology
文件页数: 8/36页
文件大小: 0K
描述: EEPROM 512KB 2.5V 400KHZ 8TSSOP
标准包装: 100
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 512K (64K x 8)
速度: 400kHz
接口: I²C,2 线串口
电源电压: 2.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 管件
产品目录页面: 1447 (CN2011-ZH PDF)
24AA512/24LC512/24FC512
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(D)
(D)
(C)
(A)
SCL
SDA
Start
Condition
FIGURE 4-2:
Address or
Acknowledge
Valid
ACKNOWLEDGE TIMING
Data
Allowed
to Change
Stop
Condition
Acknowledge
Bit
SCL
1
2
3
4
5
6
7
8
9
1
2
3
SDA
Data from transmitter
Data from transmitter
Transmitter must release the SDA line at this point
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
DS21754M-page 8
Receiver must release the SDA line
at this point so the Transmitter can
continue sending data.
? 2010 Microchip Technology Inc.
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相关代理商/技术参数
参数描述
24LC512SC/S16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN WAFFLE PK - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC/W16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC/WF16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER ON FRAME - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC-I/S16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN W - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC-I/W16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER, IND - Gel-pak, waffle pack, wafer, diced wafer on film