参数资料
| 型号： | 25AA080B-I/SN |
| 厂商： | Microchip Technology |
| 文件页数： | 15/26页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 8KBIT 10MHZ 8SOIC |
| 标准包装： | 100 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 8K (1K x 8) |
| 速度： | 10MHz |
| 接口： | SPI 3 线串行 |
| 电源电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 管件 |
| 产品目录页面： | 1448 (CN2011-ZH PDF) |
25XX080A/B
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
b
e
A
A1
A2
c
Units
L1
MILLIMETERS
L
φ
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
0.65 BSC
MAX
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
A
A2
A1
E
E1
D
L
L1
φ
c
–
0.75
0.00
0.40
0°
0.08
–
0.85
–
4.90 BSC
3.00 BSC
3.00 BSC
0.60
0.95 REF
–
–
1.10
0.95
0.15
0.80
8°
0.23
Lead Width b 0.22 – 0.40
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-111B
? 2007 Microchip Technology Inc.
DS21808D-page 15
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相关代理商/技术参数 |
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|---|---|
| 25AA080BMS | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
| 25AA080BP | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
| 25AA080BSN | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
| 25AA080BST | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
| 25AA080BT-E/MS | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K SPI Bus Serial EEPROM |
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