参数资料
型号: 25AA256T-I/ST
厂商: Microchip Technology
文件页数: 18/26页
文件大小: 0K
描述: IC EEPROM 256KBIT 10MHZ 8TSSOP
标准包装: 2,500
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 256K (32K x 8)
速度: 10MHz
接口: SPI 3 线串行
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 带卷 (TR)
25AA256/25LC256
(JEITA/EIAJ Standard, Formerly called SOIC)
8-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
1
2
e
b
α
A
A1
A2
c
Units
β
MILLIMETERS
L
φ
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
1.27 BSC
MAX
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
L
φ
c
b
α
β
1.77
1.75
0.05
7.62
5.11
5.13
0.51
0.15
0.36
2.03
1.98
0.25
8.26
5.38
5.33
0.76
0.25
0.51
15°
15°
Notes:
1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
Microchip Technology Drawing C04-056B
DS21822F-page 18
? 2007 Microchip Technology Inc.
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