参数资料
| 型号： | 25LC256-E/P |
| 厂商： | Microchip Technology |
| 文件页数： | 18/26页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 256KBIT 10MHZ 8DIP |
| 标准包装： | 60 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 256K (32K x 8) |
| 速度： | 10MHz |
| 接口： | SPI 3 线串行 |
| 电源电压： | 2.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
25AA256/25LC256
(JEITA/EIAJ Standard, Formerly called SOIC)
8-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
1
2
e
b
α
A
A1
A2
c
Units
β
MILLIMETERS
L
φ
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
1.27 BSC
MAX
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
L
φ
c
b
α
β
1.77
1.75
0.05
7.62
5.11
5.13
0.51
0°
0.15
0.36
–
–
–
–
–
–
–
–
–
–
–
–
–
–
2.03
1.98
0.25
8.26
5.38
5.33
0.76
8°
0.25
0.51
15°
15°
Notes:
1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
Microchip Technology Drawing C04-056B
DS21822F-page 18
? 2007 Microchip Technology Inc.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 25LC256-EPG | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256ESM | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256ESN | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256-ESN | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
| 25LC256-ESNG | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:256K SPI Bus Serial EEPROM |
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