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参数资料
| 型号： | 2N2222AD-# |
| 厂商： | MICROSEMI CORP-LAWRENCE |
| 元件分类： | 小信号晶体管 |
| 英文描述： | 800 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR |
| 封装： | DIE PACKAGE-3 |
| 文件页数： | 1/2页 |
| 文件大小： | 48K |
| 代理商： | 2N2222AD-# |
1
2N2222A DIE
A Microsemi Company
580 Pleasant St.
Phone: 617-924-9280
Watertown, MA 02172
Fax:
617-924-1235
DIE SPECIFICATION
SWITCHING TRANSISTOR
NPN SILICON
FEATURES:
n ELECTRICAL PERFORMANCE I.A.W. MIL-PRF-19500/255
n AVAILABLE IN WAFER OR CHIP FORM FOR HYBRID APPLICATIONS
n GENERAL PURPOSE-HIGH SPEED SWITCHING APPLICATIONS
n LOW VCE(sat): .3V @ IC = 150 mAdc
Absolute Maximum Ratings:
Symbol
Parameter
Limit
Unit
Vceo
Collector-Emitter Voltage
50
Vdc
Vcbo
Collector-Base Voltage
75
Vdc
Vebo
Emitter-Base Voltage
6.0
Vdc
Ic
Collector Current- Continuous
800
mAdc
Tj, Tstg
Operating Junction & Storage
-65 to +200 °C
Temperature Range
Sertech reserves the right to make changes to any product design, specification, or other information at any time without
prior notice.
Data Sheet, Die, 2N2222A MSW Rev. - 4/15/98
PHYSICAL DIMENSIONS
Packaging Options:
W: Wafer (100% probed)
U: Wafer (sample probed)
D:
Chip (Waffle Pack)
B: Chip (Vial)
V:
Chip (Waffle Pack, 100% visually inspected) X: Other
Processing Options:
Standard: Capable of JANTXV applications (No Suffix)
Suffix C:
Commercial
Suffix S:
Capable of S-Level equivalent applications
Metallization Options:
Standard: Al Top
/ Au Backside (No Dash #)
Dash 1:
Al Top
/
TiPdAg Backside
ORDERING INFORMATION:
PART #: 2N2222A_ _ - _
First Suffix Letter: Packaging Option
Second Suffix Letter: Processing Option
Dash #:
Metallization Option
MSC0949.PDF
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相关代理商/技术参数 |
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| 2N2222AD1 | 制造商:STMicroelectronics 功能描述:2N2222AD1 - Gel-pak, waffle pack, wafer, diced wafer on film |
| 2N2222AD-1 | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:SWITCHING TRANSISTOR NPN SILICON |
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