参数资料
型号: 2N2484UBC
厂商: MICROSEMI CORP-LAWRENCE
元件分类: 小信号晶体管
英文描述: 50 mA, 60 V, NPN, Si, SMALL SIGNAL TRANSISTOR
封装: CERAMIC PACKAGE-3
文件页数: 4/6页
文件大小: 331K
代理商: 2N2484UBC
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
Gort Road Business Park, Ennis, Co. Clare, Ireland
1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803
Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
Website: http://www.microsemi.com
T4-LDS-0058 Rev. 2 (110016)
Page 4 of 6
NOTE:
1.
Dimensions are in inches.
2.
Millimeters are given for general information only.
3.
Dimension CH controls the overall package thickness.
When a window lid is used, dimension CH must increase
by a minimum of .010 inch (0.254 mm) and a maximum
of .040 inch (1.020 mm).
4.
The corner shape (square, notch, radius) may vary at the
manufacturer's option, from that shown on the drawing.
5.
Dimensions LW2 minimum and L3 minimum and the
appropriate castellation length define an unobstructed
three-dimensional space traversing all of the ceramic
layers in which a castellation was designed.
(Castellations are required on the bottom two layers,
optional on the top ceramic layer.) Dimension LW2
maximum and L3 maximum define the maximum width
and depth of the castellation at any point on its surface.
Measurement of these dimensions may be made prior to
solder dipping.
6.
The co-planarity deviation of all terminal contact points,
as defined by the device seating plane, shall not exceed
.006 inch (0.15mm) for solder dipped leadless chip
carriers.
7.
In accordance with ASME Y14.5M, diameters are
equivalent to φx symbology.
FIGURE 2. Physical dimensions, surface mount (2N2484UA).
Dimensions
Symbol
Inches
Millimeters
Notes
Min
Max
Min
Max
BL
.215
.225
5.46
5.71
BL2
.225
5.71
BW
.145
.155
3.68
3.94
BW2
.155
3.94
CH
.061
.075
1.55
1.91
3
L3
.003
.007
0.08
0.18
5
LH
.029
.042
0.74
1.07
LL1
.032
.048
0.81
1.22
LL2
.072
.088
1.83
2.24
LS
.045
.055
1.14
1.39
LW
.022
.028
0.56
0.71
LW2
.006
.022
0.15
0.56
5
Pin no.
1
2
3
4
Transistor
Collector
Emitter
Base
N/C
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