参数资料
型号: 2N7002LT3
厂商: ON Semiconductor
文件页数: 1/4页
文件大小: 0K
描述: MOSFET N-CH 60V 115MA SOT-23
产品变化通告: Product Obsolescence 11/Feb/2009
Wire Change for SOT23 Pkg 26/May/2009
标准包装: 10,000
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 115mA
开态Rds(最大)@ Id, Vgs @ 25° C: 7.5 欧姆 @ 500mA,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
输入电容 (Ciss) @ Vds: 50pF @ 25V
功率 - 最大: 225mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23-3(TO-236)
包装: 带卷 (TR)
2N7002L, 2V7002L
Small Signal MOSFET
60 V, 115 mA, N ? Channel SOT ? 23
Features
? 2V Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC ? Q101 Qualified and
http://onsemi.com
PPAP Capable (2V7002L)
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
V (BR)DSS
60 V
R DS(on) MAX
7.5 W @ 10 V,
500 mA
I D MAX
115 mA
Rating
Drain ? Source Voltage
Drain ? Gate Voltage (R GS = 1.0 M W )
Drain Current
? Continuous T C = 25 ° C (Note 1)
? Continuous T C = 100 ° C (Note 1)
? Pulsed (Note 2)
Symbol
V DSS
V DGR
I D
I D
I DM
Value
60
60
± 115
± 75
± 800
Unit
Vdc
Vdc
mAdc
1
N ? Channel
3
Gate ? Source Voltage
? Continuous
? Non ? repetitive (t p ≤ 50 m s)
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR ? 5 Board
(Note 3) T A = 25 ° C
Derate above 25 ° C
Thermal Resistance, Junction ? to ? Ambient
V GS
V GSM
Symbol
P D
R q JA
± 20
± 40
Max
225
1.8
556
Vdc
Vpk
Unit
mW
mW/ ° C
° C/W
1
3
2
SOT ? 23
CASE 318
2
1
MARKING
DIAGRAM
702 M G
G
(Note 4) Alumina Substrate, T A = 25 ° C
Derate above 25 ° C
Thermal Resistance, Junction ? to ? Ambient
2N7002LT3G
10,000 Tape & Reel
Total Device Dissipation P D
300 mW
2.4 mW/ ° C
R q JA 417 ° C/W
Junction and Storage Temperature T J , T stg ? 55 to ° C
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The Power Dissipation of the package may result in a lower continuous drain
current.
2. Pulse Test: Pulse Width ≤ 300 m s, Duty Cycle ≤ 2.0%.
3. FR ? 5 = 1.0 x 0.75 x 0.062 in.
4. Alumina = 0.4 x 0.3 x 0.025 in 99.5% alumina.
STYLE 21
702 = Device Code
M = Date Code*
G = Pb ? Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device Package Shipping ?
2N7002LT1G SOT ? 23 3000 Tape & Reel
(Pb ? Free)
2V7002LT1G
3000 Tape & Reel
2V7002LT3G
2N7002LT1H*
SOT ? 23
(Pb ? Free)
10,000 Tape & Reel
3000 Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Not for new design.
? Semiconductor Components Industries, LLC, 2013
April, 2013 ? Rev. 7
1
Publication Order Number:
2N7002L/D
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