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参数资料
| 型号： | 30-1/B4C-AKNB |
| 厂商： | Everlight Electronics Co Ltd |
| 文件页数： | 10/12页 |
| 文件大小： | 356K |
| 描述： | LED PWR 3MM INGAN BLUE WATER CLR |
| 标准包装： | 60 |
| 颜色： | 蓝 |
| 正向电压： | 3.3V |
| 电流 - 测试： | 30mA |
| 波长 - 主： | 470nm |
| 波长 - 峰值： | 468nm |
| 视角： | 80° |
| 透镜类型： | 透明 |
| 透镜样式/尺寸： | 圆形，带圆顶，3mm |
| 封装/外壳： | 4-DIP（0.200"，5.08mm） |
| 尺寸/尺寸： | 7.62mm L x 7.62mm W |
| 高度： | 4.00mm |
| 安装类型： | 通孔 |
| 包装： | 管件 |
| 在特定电流下的光通量 - 测试： | 2 lm |
EVERLIGHT ELECTRONICS CO., LTD.
Technical Data Sheet
3mm Piranha
30-01-B4C-AKNB
Everlight Electronics Co., Ltd.
http://www.everlight.com
Rev.: 2.0
Page: 10 of 12
Device No.: DLE-300-097
Published date: Nov.-24-2009 Created by: Ken Lee
Notes
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of
the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may
damage the LEDs characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the
lead position of the LED. If the LEDs are mounted with stress at the leads, it causes
deterioration of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30癈 or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or
more, they can be stored for a year in a sealed container with a nitrogen atmosphere and
moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering
Careful attention should be paid during soldering. Solder the LED no lower than 1.6mm
from the base of stopper is recommended.
Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
Recommended soldering conditions:
Hand Soldering
DIP Soldering
Temp. at tip of iron
300 Max.
(30W Max.)
Preheat temp.
100 Max.
(60 sec Max.)
Soldering time
3 sec Max.
Bath temp.
260 Max.
Distance
No lower than 1.6mm from
the base of stopper
Bath time.
5 sec Max.
Distance
No lower than 1.6mm from
the base of stopper
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