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参数资料
| 型号： | 3090-682K |
| 厂商： | API Delevan Inc |
| 文件页数： | 1/1页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR RF CHIP 6.8UH 10% SMD |
| 标准包装： | 1,000 |
| 系列： | 3090 |
| 电感： | 6.8µH |
| 电流： | 135mA |
| 类型： | 铁粉芯 |
| 容差： | ±10% |
| 屏蔽： | 屏蔽 |
| DC 电阻(DCR)： | 最大 4 欧姆 |
| Q因子@频率： | 22 @ 7.9MHz |
| 频率 - 自谐振： | 50MHz |
| 材料 - 芯体： | 铁 |
| 封装/外壳： | 0.100" L x 0.100" W x 0.050" H（2.54mm x 2.54mm x 1.27mm） |
| 安装类型： | 表面贴装 |
| 包装： | 带卷 (TR) |
| 工作温度： | -55°C ~ 125°C |
| 频率 - 测试： | 7.9MHz |
SERIES
3090R
3090
Micro i ? Low Pro?le Chip Inductors
SERIES 3090 IRON CORE
-100M
-150M
-220M
-330K
-390K
-470K
-560K
-680K
-820K
-101K
-121K
-151K
-181K
-221K
0.010
0.015
0.022
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
± 20%
± 20%
± 20%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
42
42
40
40
40
38
35
30
25
32
32
32
32
34
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
25.0
25.0
25.0
25.0
25.0
1000
1000
1000
900
900
900
800
700
650
510
410
370
330
300
0.095
0.115
0.140
0.185
0.100
0.110
0.135
0.16
0.19
0.08
0.10
0.12
0.14
0.16
890
810
765
640
870
830
750
690
630
970
870
795
765
690
Physical Parameters
Actual Size
-271K
-331K
-391K
-471K
0.27
0.33
0.39
0.47
± 10%
± 10%
± 10%
± 10%
34
34
34
34
25.0
25.0
25.0
25.0
250
220
200
180
0.20
0.25
0.30
0.36
615
550
500
460
Inches
Millimeters
-561K
0.56
± 10%
34
25.0
160
0.45
410
A
B
C
D
E
F
0.050 Max.
0.100±0.010
0.100±0.010
0.050 Min.
0.015 Min. (Typ.)
0.020 Max. (Typ.)
1.27 Max.
2.54±0.254
2.54±0.254
1.27 Min.
0.38 Min. (Typ.)
0.51 Max. (Typ.)
-681K
-821K
-102K
-122K
-152K
-182K
-222K
-272K
0.68
0.82
1.00
1.20
1.50
1.80
2.20
2.70
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
30
28
24
24
24
24
25
25
25.0
25.0
25.0
7.9
7.9
7.9
7.9
7.9
140
120
100
95
90
85
80
70
0.50
0.60
0.70
1.10
1.20
1.25
1.30
1.50
390
355
330
265
250
245
240
225
Current Rating at 90°C Ambient 35°C Rise
Operating Temperature Range –55°C to +125°C
Maximum Power Dissipation at 90°C 0.105 W
Core Material Powdered iron core for improved
-332K
-392K
-472K
-562K
-682K
-822K
-103K
3.30
3.90
4.70
5.60
6.80
8.20
10.0
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
25
25
24
22
22
22
20
7.9
7.9
7.9
7.9
7.9
7.9
7.9
65
60
55
53
50
45
40
1.90
2.30
3.00
3.50
4.00
4.50
5.00
200
180
160
145
135
130
120
temperature stability.
Mechanical Con?guration Units are epoxy
encapsulated. Contact area for re?ow soldering are gold
plated per MIL-G-45204 Type 1 Grade A. Internal
Optional Tolerances: J = 5% H = 3% G = 2% F = 1%
connections are thermal compression bonded.
*Complete part # must include series # PLUS the dash #
Termination Finish Options
Standard: Gold over Nickel.
For surface ?nish information, refer to www.delevan?nishes.com
For Tin/Lead over Nickel: Add suf?x “S” to part number and
allow an additional .010 inch for maximum height. For
RoHS, order 3090R - XXXKS.
Notes 1) Designed speci?cally for re?ow soldering and
other high temperature processes with metalized edges to
exhibit solder ?llet. 2) Self Resonant Frequency (SRF)
values 250 MHz and above are calculated and for
reference only.
Packaging Tape & reel (8mm): 7" reel, 2000 pieces max.;
13" reel, 8000 pieces max.
MIL-PRF-83446 ( Reference) for testing methods only.
Made in the U.S.A.
270 Quaker Rd., East Aurora NY 14052 ? Phone 716-652-3600 ? Fax 716-652-4814 ? E-mail: apisales@delevan.com ? www.delevan.com
1/2009
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