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参数资料
型号： 335214B00032G
厂商： Aavid Thermalloy
文件页数： 70/116页
文件大小： 0K
描述： BGA HEAT SINK
产品培训模块： How to Select a Heat Sink
标准包装： 600
类型： 顶部安装
冷却式包装： BGA
固定方法： 散热带，粘合剂（含）
形状： 方形
长度： 0.985"（25.02mm）
宽： 0.985"（25.02mm）
机座外的高度（散热片高度）： 0.390"（9.91mm）
材质： 铝
材料表面处理： 黑色阳极化处理
其它名称： 043314
57
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
7.62
(0.300)
16.51
(0.650)
25.65
(1.01)
REF
6.60
(0.260)
2.39
(0.093)
3.96
(0.156)
17.02
(0.670)
41.91
(1.650)
25.40
(1.000)
25.40
(1.000)
"B"
"A"
3.18 (0.125)
X 0.64 (0.025)
HIGH DITTIN
2x
A
3.17
(0.125)
VIEW A-A
SINGLE HEAT SINK DEVICE
17.02
(0.670)
41.91
(1.650)
25.40
(1.000)
VIEW A-A
DUAL HEAT SINK DEVICE
12.70
(0.500)
13.72
(0.540)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
5334XX
5335XX
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Extruded heat sink with large
radial fins and channel clip
attach feature makes device
attachment easy. Includes clip
and two solderable mounting
pins which permit vertical
mounting and eliminate stress
on device leads. Available in
four heights for TO-220, TO-218,
and TO-247 devices.
5334, 5335, 5336, 5337 Extruded heat sink with large radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
Description
“A” Dim
“B” Dim
533401B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
38.10 (1.500)
21.59 (0.850)
2.67 (0.105)
533402B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
38.10 (1.500)
18.29 (0.720)
2.67 (0.105)
533421B02552G
Dual TO-218, TO-247
With 2 device clips #52
38.10 (1.500)
21.59 (0.850)
2.67 (0.105)
533422B02552G
Dual TO-220
With 2 device clips #52
38.10 (1.500)
18.29 (0.720)
2.67 (0.105)
533501B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
50.80 (2.000)
21.59 (0.850)
2.67 (0.105)
533502B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
50.80 (2.000)
18.29 (0.720)
2.67 (0.105)
533521B02552G
Dual TO-218, TO-247
With 2 device clips #52
50.80 (2.000)
21.59 (0.850)
2.67 (0.105)
533522B02552G
Dual TO-220
With 2 device clips #52
50.80 (2.000)
18.29 (0.720)
2.67 (0.105)
533601B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
63.50 (2.500)
21.59 (0.850)
2.67 (0.105)
533602B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
63.50 (2.500)
18.29 (0.720)
2.67 (0.105)
533621B02552G
Dual TO-218, TO-247
With 2 device clips #52
63.50 (2.500)
21.59 (0.850)
2.67 (0.105)
533622B02552G
Dual TO-220
With 2 device clips #52
63.50 (2.500)
18.29 (0.720)
2.67 (0.105)
533701B02552G
TO-218, TO-247
Extruded heat sink with radial fins and device clip #52
25.40 (1.000)
21.59 (0.850)
2.67 (0.105)
533702B02552G
TO-220
Extruded heat sink with radial fins and device clip #52
25.40 (1.000)
18.29 (0.720)
2.67 (0.105)
533721B02552G
Dual TO-218, TO-247
With 2 device clips #52
25.40 (1.000)
21.59 (0.850)
2.67 (0.105)
533722B02552G
Dual TO-220
With 2 device clips #52
25.40 (1.000)
18.29 (0.720)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
5336XX
5337XX
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
For additional options see page 83
CLIP 52
Grease
Epoxy
&
page112
SEE NOTE 1
NOTE 1: Graph depicts single device models. Dual device models
exhibit a 15% performance increase.
相关PDF资料
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相关代理商/技术参数
参数描述
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