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参数资料
型号： 371824B00034G
厂商： Aavid Thermalloy
文件页数： 75/116页
文件大小： 0K
描述： HEATSINK BGA W/ADHESIVE TAPE
产品培训模块： How to Select a Heat Sink
产品目录绘图： 3(3,6,7)xx24B Series
(3747,3718)24B000(32,34)G Top
371824B00034G Side
标准包装： 910
类型： 顶部安装
冷却式包装： BGA
固定方法： 散热带，粘合剂（含）
形状： 方形，鳍片
长度： 1.378"（35.00mm）
宽： 1.378"（35.00mm）
机座外的高度（散热片高度）： 0.275"（7.00mm）
温升时的功耗： 1.5W @ 50°C
在强制气流下的热敏电阻： 在 200 LFM 时为9.7°C/W
自然环境下的热电阻： 31.9°C/W
材质： 铝
材料表面处理： 黑色阳极化处理
产品目录页面： 2673 (CN2011-ZH PDF)
其它名称： HS393
61
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6374
Extruded heat sink for SIP packages
Extruded heat sink for SIP
packages. Solderable pins
allow vertical mounting
without stress on the device
leads. Can also be used for
dual TO-220, TO-218, TO-247,
and multiwatt devices.
3.96
(0.156)
2.18
(0.086)
31.75
(1.250)
38.10
(1.500)
2.92
(0.115)
17.50
(0.689)
32.00
(1.260)
16.00
(0.630)
8.00
(0.315)
DETAIL A
SEE DETAIL A
24.38
(0.960)
59.99
(2.362)
17.78
(0.700)
3.81
(0.150)
2X
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
5
0
20
40
60
80
100
02
4
6
8
10
4
3
1
2
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
6374BG
Extruded heat sink with solderable pins
2.89 (0.114)
Dia of PCB
Plated Thru
Hole for Pins
YB32-4
High power flat back extruded channel style heat sink
High power flat back extruded channel
style heat sink features a wide channel
to accommodate several devices. Includes
two solderable pins to allow vertical
mounting without stress on the device
leads. Can be used with TO-220, TO-218,
TO-247, and multiwatt devices.
2X 3.00
(0.118)
19.00
(0.748)
4.00
(0.157)
38.30
(1.508)
3.10
(0.122)
THRU
16.00
(0.630)
32.00
(1.260)
4.70
(0.185)
60.00
(2.362)
2X
32.00
(1.260)
8.00
(0.315)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
0
2
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
YB32-4G
High power flat back extruded heat sink
3.48 (0.137)
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
5810, 5811, 5812
Flat back extruded heat sink featuring solderable pins
Flat back extruded heat sink features
solderable pins which allow vertical
mounting without stess on the device
leads. Available in three heights for
TO-220 and TO-218 devices.
10.29
(0.405)
TYP 2
2.36
(0.093)
3.96
(0.156)
8.13
(0.320)
16.26
(0.640)
"A"
16.26
(0.640)
3.45
(0.136)
#6 - 32 UNC THRU
"B"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—
°C/W
at
t
10
0
20
40
60
80
100
01
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
58110X
58100X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—
°C
58120X
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
581001B02500G
TO-218
25.40 (1.000)
21.59 (0.850)
2.67 (0.105)
581002B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
2.67 (0.105)
581101B02500G
TO-218
38.10 (1.500)
21.59 (0.850)
2.67 (0.105)
581102B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
2.67 (0.105)
581201B02500G
TO-218
50.80 (2.000)
21.59 (0.850)
2.67 (0.105)
581202B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 85
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Dia of PCB
Plated Thru
Hole for Pins
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