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参数资料
| 型号： | 386820 |
| 厂商： | Multicore |
| 文件页数： | 1/2页 |
| 文件大小： | 0K |
| 描述： | 63/37 HYDRO-X 2% .022DIA/24SWG |
| MSDS 材料安全数据表： | MM00991 MSDS |
| 标准包装： | 40 |
| 系列： | Hydro-X |
| 制程： | 有引线 |
| 类型： | 焊线 |
| 焊剂类型： | 水溶性 |
| 复合体： | Sn63Pb37（63/37） |
| 线规： | 24 |
| 直径： | 0.022"（0.56mm） |
| 芯体尺寸： | 2% |
| 形态： | 线轴，227g（1/2 磅） |
| 融点： | 361°F（183°C） |
| 其它名称： | 82-134 |
Technical Data Sheet
Multicore Hydro-X
September 2007
HIGH ACTIVITY WATER SOLUBLE CORED
SOLDER WIRE
Properties of Multicore Hydro-X solid flux cored solder
wires:
Rapid soldering of most difficult to solder parts
Fast wetting
Water washable, no need for added neutralisers
No insoluble residues
No spitting
Residues must be removed
PRODUCT RANGE
Multicore Hydro-X cored wires are manufactured with a
flux content of 2%.
Multicore Hydro-X cored wires are available in a variety of
alloys conforming to J-STD-006 and EN 29453 or alloys
conforming to similar national or international standards.
For details refer to document “Properties of Alloys used in
Cored Solder Wires”. A wide range of wire diameters is
available.
APPLICATION
Multicore Hydro-X water soluble flux cored solder wires
are suitable for use in normal hand soldering operations
where the components have been assessed as being able to
withstand the necessary washing procedures.
Stranded wire should not be used. Strip any insulation back
so that flux residues are not trapped during the washing
process.
CLEANING
It is essential that the residues from soldering with
Multicore Hydro-X cored solder wires be removed as soon
as possible after soldering. The residues from Multicore
Hydro-X cored solder wires may be readily cleaned in
conventional equipment using water. It is important that the
cleanliness of boards and components is thoroughly
checked after soldering and cleaning. The usual procedure
is to continuously check the conductivity of the final rinse
water as a measure of ionic contamination. Samples of
cleaned boards should be subjected to a laboratory
corrosion test, insulation resistance test, or ionic
contamination assessment.
RECOMMENDED OPERATING CONDITIONS
Soldering iron: Good results should be obtained using a
range of tip temperatures. However, the optimum tip
temperature and heat capacity required for a hand soldering
process is a function of both soldering iron design and the
nature of the task and care should be exercised to avoid
unnecessarily high tip temperatures for excessive times. A
high tip temperature will increase any tendency to flux
spitting and it may produce some residue darkening.
The soldering iron tip should be properly tinned and this
may be achieved using Multicore cored wire. Severely
contaminated soldering iron tips should first be cleaned and
pre-tinned using Multicore Tip Tinner/Cleaner, then wiped
on a clean, damp sponge before re-tinning with Multicore
cored wire.
Soldering process: To achieve the best results from
Multicore solder wires, recommended working practices for
hand soldering should be observed as follows:
Apply the soldering iron tip to the work surface,
ensuring that it simultaneously contacts the base
material and the component termination to heat both
surfaces adequately. This process should only take a
fraction of a second.
Apply Multicore flux cored solder wire to a part of the
joint surface away from the soldering iron and allow to
flow sufficiently to form a sound joint fillet – this
should be virtually instantaneous. Do not apply
excessive solder or heat to the joint as this may result
in dull, gritty fillets and excessive or darkened flux
residues.
Remove solder wire from the work piece and then
remove the iron tip.
The total process will be very rapid, depending upon
thermal mass, tip temperature and configuration and the
solderability of the surfaces to be joined.
Multicore flux cored solder wires provide fast soldering on
copper and brass surfaces as well as solder coated
materials. Activity of the halide activated versions on
nickel is also good depending on the state of oxidation of
the nickel finish. The good thermal stability of Multicore
fluxes means they are also well suited to soldering
applications requiring high melting temperature alloys
NOT FOR PRODUCT SPECIFICATIONS.
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL
TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
PRODUCT.
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相关代理商/技术参数 |
参数描述 |
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| 38-6820-90C | 功能描述:IC 与器件插座 VERTISOCKETS HORIZ COLLET 38 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 38-6822-90C | 功能描述:IC 与器件插座 VERTISOCKETS HORIZ COLLET 38 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 38-6823-90 | 功能描述:IC 与器件插座 VERTISOCKETS HORIZ BIFURCATED 38 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 38-6823-90C | 功能描述:IC 与器件插座 VERTISOCKETS HORIZ COLLET 38 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 38-6823-90T | 功能描述:IC 与器件插座 VERTISOCKETS HORIZ BIFURCATED 38 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
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