参数资料
型号: 3DK2218-SS
厂商: Renesas Electronics America
文件页数: 5/5页
文件大小: 0K
描述: KIT DEV H8S/2218 WINDOWS SIDESHW
产品培训模块: H8S Product Overview
H8S Architecture Overview
Electromagnetic Noise Reduction Techniques Part 1
H8S MCU Analog Interface
H8S Peripherals Overview
H8S On-Chip Flash Memory
H8S Microcontroller Timer Peripherals
Application-Specific Serial Interfaces in H8S MCU’s
标准包装: 1
系列: H8®
类型: MCU
适用于相关产品: H8S/2218
所含物品: 3-D 板、跳线链路、接头连接器和光盘
相关产品: DF2218UBR24V-ND - IC H8S/2218U MCU FLASH 112-LFBGA
DF2218BR24V-ND - IC H8S/2218 MCU FLASH 112-LFBGA
DF2218UTF24V-ND - IC H8S MCU FLASH 128K 100TQFP
DF2218TF24V-ND - IC H8S MCU FLASH 128K 100TQFP
HD64F2218UTF24-ND - IC H8S MCU FLASH 128K 100-TQFP
HD64F2218TF24-ND - IC H8S MCU FLASH 128K 100-TQFP
A
1
2
Board_VCC
3
4
5
Board_VCC
6
A
U6
1C2,4B4
PIN30
(P36)
SN74LVC126APW
1
EN 1
2 3
4
EN
5 6
10
EN
9 8
R76
1
NC
1K5
2
VBUS
1B4,4B5
GROUND
Decoupling for Logic device
13
12
EN
11
NC
GROUND
VCC=Board_VCC
GROUND
1
R63 DNF_0603
2
USB_Supply
2C1
B
GROUND
USB_SHIELD
R12
1
100K
2
B
J13
GROUND
5V
NC
KMB-SMT-5S-S-30TR
1
SKT
2 3
DNEG DPOS
4 5
ID GND
R66
1
24R
2
USD_PLUS
1B4
SHIELD=USB_SHIELD
GROUND
R64
1
24R
2
USD_MINUS
1B4
GROUND
C
GROUND
Board_VCC
C
R57
Fitted for Self powered mode
To enable bus powered mode fit 0R link in DNF location
1B4,4B5
UBPMn
R55
SIZE A4
GROUND
RENESAS TECHNOLOGY EUROPE LTD
Dukes Meadow, Bourne End, Buckinghamshire
D
SCHEMATIC TITLE
SHEET TITLE
UNITED KINGDOM
3DK2218
USB Circuitry
D
DRAWN BY
DATE
REV DRAWING NUMBER PAGE
D.Fife
15-06-04
2
D005312_04
5
5
1
2
3
4
5
6
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