参数资料
| 型号： | 4-5-8810 |
| 厂商： | 3M (TC) |
| 文件页数： | 5/8页 |
| 文件大小： | 0K |
| 描述： | TAPE THERMAL COND 4"X5YD |
| MSDS 材料安全数据表： | 8805,8810,8815,8820 MSDS |
| 标准包装： | 1 |
| 系列： | 8810 |
| 胶带类型： | 胶粘传输带 |
| 胶合剂： | 压敏胶合剂（PSA） |
| 背衬，载体： | 聚合物 |
| 厚度： | 0.0100"（10.0 mils，0.254mm） |
| 宽： | 4.00"（101.60mm）1/3' |
| 长度： | 15'（4.6m）5 码 |
| 颜色： | 白 |
| 使用： | 热导电 |
| 包装： | 散装 |
3M ? Thermally Conductive Adhesive Transfer Tapes
8805 ? 8810 ? 8815 ? 8820
Available Sizes
Width: Maximum width 22 inches.
Length: Multiples of 36 yds. Maximum 108 yds.
Custom Sizes: Contact your local 3M sales representative for information and availability of custom sizes (width and
length) or die cut parts of 3M? Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820.
Application Guidelines
1.) Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-
free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use
“denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes
before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be
required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final
isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.
2.) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help
reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning
the tape onto the first substrate.
3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the
tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of
the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a
thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible
parts with much less concern about air entrapment because one of the flexible substrates can conform to the other
substrate.
4.) Application pressure guideline table for 3M? Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820.
Substrate
Rigid to rigid
Flexible to rigid
Flexible to flexible
Application Conditions
Minimum: 15 psi at room temperature
Preferred: 50 psi at room temperature
More pressure equals better wetting
Minimum: 5 psi at room temperature
Preferred: 15 psi at room temperature
Minimum: 5 psi at room temperature
Preferred: 15 psi at room temperature
(5)
Time
2 sec
5 sec
1 sec
5 sec
1 sec
5 sec
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