参数资料
型号: 4416P-1-203
厂商: Bourns Inc.
文件页数: 1/2页
文件大小: 0K
描述: RES ARRAY 20K OHM 8 RES 16-SOIC
产品变化通告: Marking Change May 2012
标准包装: 1,500
系列: 4400P
电路类型: 隔离
电阻(欧姆): 20k
电阻数: 8
引脚数: 16
每个元件的功率: 160mW
容差: ±2%
温度系数: ±100ppm/°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
尺寸/尺寸: 0.410" L x 0.295" W(10.41mm x 7.49mm)
高度: 0.104"(2.65mm)
包装: 带卷 (TR)
工作温度: -55°C ~ 125°C
Features
■ RoHS compliant*
■ Standard E.I.A. package compatible with
automatic placement equipment
■ Compliant leads to reduce solder joint
fatiguing
■ Standard electrical schematics: isolated,
bussed, dual terminator
■ Custom circuits are available
■ Now available with improved tolerance to
±0.5 %
■ Tape and reel packaging standard
4400P Series - Thick Film Surface Mounted Wide Body
Product Characteristics
Package Power Temp. Derating Curve
Product Dimensions
Resistance Range
................... 10 ohms to 2.2 megohms
Maximum Operating Voltage ...........50 V
Temperature Coef?cient of Resistance
50 Ω and above..............±100 ppm/°C
below 50 Ω .....................±250 ppm/°C
TCR Tracking.........................50 ppm/°C
maximum; equal values
Operating Temperature
................................-55 °C to +125 °C
Insulation Resistance
................ 10,000 megohms minimum
2.25
2.00
1.75
1.50
1.25
1.00
.75
.50
.25
0
4416P
25
4420P
70 125
4420P
7.493 .076
(.295 .003)
10.34 .25
(.407 .010)
10.41 .05
(.410 .003)
.406
(.016
.025
.001)
12.95 .05
(.510 + .001/ -.002)
Dielectric Withstanding Voltage
...........................................200 VRMS
AMBIENT TEMPERATURE ( ° C )
Lead Solderability .....Meet requirements
of MIL-STD-202 Method 208
Environmental Characteristics
Package Power Rating at 70 °C
4420P .....................................2.00 watts
1.27 .076
(.050 .003*)
.127 + .127/ - .000
(.005 + .005/ - .000)
TYP.
TESTS PER MIL-STD-202 ...... ?R MAX.
Short Time Overload..................±0.25 %
4416P .....................................1.60 watts
2.65
(.104)
MAX.
Load Life ....................................±1.00 %
Moisture Resistance ..................±0.50 %
Recommended Land Pattern
.305 + .000/ - .076
(.012 + .000/ - .003)
Resistance to Soldering Heat ....±0.25 %
Thermal Shock ..........................±0.25 %
Physical Characteristics
1
2
2.0
(.079)
TYP.
20
19
8 ° MAX.
.94 + .33/ - .35
(.037 + .013/ - .014)
TYP.
TYP.
Flammability ........ Conforms to UL94V-0
Lead Frame Material
.........................Copper, solder coated
Body Material.................. Novolac epoxy
1.27
(.050)
.63
(.025)
3
4
5
6
7
8
9
18
17
16
15
14
13
12
SO-16L
.63
(.025)
SO-20L
12.07
(.475)
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
10
11
How To Order
44 20 P - 1 - 103 __ LF
11.6
(.457)
7.6
(.299)
Typical Part Marking
Represents total content. Layout may
CODE
Model
(44 = SMD SOL
Pkg.)
Number of Pins
Electrical Con?guration
? 1 or 4 = Isolated*
? 2 = Bussed*
? 3 = Dual Terminator*
Resistance Code
? First 2 digits are signi?cant
? Third digit represents the
NOTE: Land pattern dimensions are based on
design rules established by the Institute for Inter-
connecting and Packaging Electronic Circuits in
IPC-SM-782.
For Standard Values Used in
Capacitors, Inductors, and Resistors,
vary.
PART
NUMBER
CIRCUIT
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
RESISTANCE
4416P-
2-472
CYYWW
DATE CODE
COUNTRY OF MANUFACTURE
(C = COSTA RICA)
number of zeros to follow.
Resistance Tolerance
? Blank = ±2 % (see “Resistance Tolerance”
on next page for resistance range)
? F = ±1 % (100 ohms - 1 megohm)
? D = ±0.5 % (100 ohms - 1 megohm)
Terminations
? All electrical con?gurations EXCEPT T03:
LF = Tin-plated (RoHS compliant)
? ONLY electrical con?guration T03:
L = Tin-plated (RoHS compliant)
*For tube packaging, use T01, T02, T03 or T04.
Consult factory for other available options.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Speci?cations are subject to change without notice.
Customers should verify actual device performance in their speci?c applications.
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