参数资料
型号: 4463-TSQ27F169-EK
厂商: Silicon Laboratories Inc
文件页数: 52/56页
文件大小: 0K
描述: KIT EZRADIO TEST CARD SI4463 TX
设计资源: 4463-TSQ27F169 PCB
4463-TSQ27F169 SCH
标准包装: 1
系列: EZRadioPRO®
类型: 收发器,ISM
频率: 169MHz
适用于相关产品: Si4463
已供物品:
Si4464/63/61/60
Table 18. PCB Land Pattern Dimensions
Symbol
Min
Millimeters
Max
C1
C2
E
X1
X2
Y1
Y2
3.90
3.90
0.20
2.55
0.65
2.55
0.50 REF
4.00
4.00
0.30
2.65
0.75
2.65
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on IPC-7351 guidelines.
Solder Mask Design
3. All metal pads are to be non-solder mask defined (NSMD). Clearance
between the solder mask and the metal pad is to be 60 μm minimum, all
the way around the pad.
Stencil Design
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
walls should be used to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for the
perimeter pads.
7. A 2x2 array of 1.10 x 1.10 mm openings on 1.30 mm pitch should be
used for the center ground pad.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for small body components.
52
Rev 1.2
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