参数资料
型号: 450-0075
厂商: LS Research LLC
文件页数: 25/45页
文件大小: 0K
描述: MODULE PROFLEX01-R2 F ANTENNA
标准包装: 25
系列: Pro-Flex01
频率: 2.4GHz
数据传输率 - 最大: 250kbps
调制或协议: 802.15.4 Zigbee,6LoWPAN,ISM
应用: 通用
功率 - 输出: 100mW
灵敏度: -99dBm
电源电压: 2 V ~ 3.3 V
电流 - 接收: 30mA
电流 - 传输: 149mA
数据接口: 焊接垫
存储容量: 256kB 闪存,16kB SRAM
天线连接器: 板载,跟踪
工作温度: -40°C ~ 85°C
封装/外壳: 模块
包装: 托盘
ProFLEX01-R2 TRANSCEIVER MODULE
DATASHEET
CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the ProFLEX01-R2 modules are
delivered in trays of 25.
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Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
Handling
The ProFLEX01-R2 modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may destroy or damage
the module permanently. ESD protection may
destroy or damage the module permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
module permanently.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
Bake devices for 48 hours at 125°C.
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Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
Storage
Please use this product within 6 months after
receipt. Any product used after 6 months of
receipt needs to have solderability confirmed
before use.
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
Never attempt a rework on the
module itself, e.g. replacing
individual components. Such actions
will terminate warranty coverage.
The product shall be stored without opening the
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be
deformed at the temperatures above this range.)
Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
The information in this document is subject to change without notice.
330-0098-R2.0
Copyright ? 2012 LS Research, LLC
Page 25 of 45
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450-0084 功能描述:Zigbee/802.15.4开发工具 SiFLEX02-HP U.fl Development Kit RoHS:否 制造商:Silicon Labs 产品:Development Kits 工具用于评估:EM35x 频率:2.4 GHz 接口类型:USB 工作电源电压:
450-0085 功能描述:WiFi/802.11开发工具 COM6L-T5 adapter brd w/ U.FL connector RoHS:否 制造商:Roving Networks 产品:Evaluation Boards 工具用于评估:RN-171 支持协议:802.11 b/g 频率:2.4 GHz 接口类型:UART 工作电源电压:2 V to 16 V
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450-0089 功能描述:WiFi/802.11开发工具 TiWi-SL CC3000 EVM Board-Chip Antenna RoHS:否 制造商:Roving Networks 产品:Evaluation Boards 工具用于评估:RN-171 支持协议:802.11 b/g 频率:2.4 GHz 接口类型:UART 工作电源电压:2 V to 16 V