参数资料
| 型号： | 5-146290-3 |
| 厂商： | TE Connectivity |
| 文件页数： | 66/96页 |
| 文件大小： | 0K |
| 描述： | CONN HEADER BRKWAY 3POS SNGL TIN |
| RoHS指令信息： | 5-146290-3 Statement of Compliance |
| 3D 型号： | 5-146290-3.pdf |
| 标准包装： | 2,700 |
| 系列： | AMPMODU |
| 触点类型：： | 公形引脚 |
| 连接器类型： | 接头，无罩，可断开式 |
| 位置数： | 3 |
| 加载位置的数目： | 全部 |
| 间距： | 0.100"（2.54mm） |
| 行数： | 1 |
| 触点接合长度： | 0.230"（5.84mm） |
| 安装类型： | 通孔 |
| 端子： | 压配式 |
| 触点表面涂层： | 锡 |
| 触点涂层厚度： | 100µin（2.54µm） |
| 颜色： | 黑 |
| 包装： | 散装 |
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AMPMODU Interconnection System
ACTION PIN Press-Fit Posts
The Reliable Plated-Through Hole Interconnect
Solderless interconnections have been popular in electrical
and electronic applications with world-wide success for
decades. They provide reliable electrical and mechanical
stability and offer applied-cost savings across the board.
For PC board applications, compliant ACTION PIN posts
provide these features:
■ Large gas-tight contact zone
■
■
■
■
■
■
High reliability due to stored energy
More resistant to damage to plated-through holes during
installation
Especially suited for multilayer PC boards
Less costly board manufacturing due to larger hole
tolerances compared to use of solid pins
Application can be made by end-user
Repairability—contact can be replaced in the same pin
location (two repairs)
Principle of the Compliant ACTION PIN Post
■
■
■
Installation with no heat cycling of board
Permits mass insertion by minimizing forces needed to
insert pins as compared to solid pin press-fit application
Significant applied-cost savings in many applications
When a compliant ACTION PIN post is inserted into a
plated-through hole, two spring members are compressed,
exerting force against the hole for a gas-tight connection.
The diameter of the hole is smaller than the diagonal size of
the pin (see cross-section illustration below).
Since compliant ACTION PIN posts do not have to be
soldered, problems associated with solder are eliminated,
such as:
The beam characteristics of the pin are designed so that a
plastic, as well as an elastic, deformation takes place during
insertion. The two spring members compress to different
■
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Faulty solder joints
Solder fumes; contaminants are deposited on the
contacts
Solder spots; short circuits between printed circuits
degrees to accommodate hole tolerances. The compliant
pin also reduces strain on the board. With a rigid pin, the
elastic strain energy is stored entirely in the board, leading
to damage of the plated-through holes. With the compliant
ACTION PIN post, the residual force of the elastic
5
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Flux residuals
Thermal strain on printed circuit boards and
components
Degassing of plated-through holes
deformation maintains stored energy to produce a tight
contact zone between the pin and the plated-through hole.
This maintains long-term electrical and mechanical
reliability of the interconnection.
Solderless press-fit interconnections using compliant pins
are primarily integrated in, but not limited to, backplanes.
Solderless press-fit interconnections are used in racks,
especially where connectors must be fixed on the solder
side of the PC board and/or component side. In these
applications, the holes for ACTION PIN post connectors are
covered during the soldering process and press-fitting is
performed after soldering.
Other applications for ACTION PIN post interconnections
include PC boards that incorporate components using
surface mount technology (SMT). Here, too, press-fit
interconnections can be applied after soldering, thus
eliminating complications associated with connectors
suitable for surface mounting.
Minimum
Hole Dia.
.037 [0.94]
Maximum
Hole Dia.
.043 [1.09]
Cross-Section Area of ACTION PIN Press-Fit Post in Printed Circuit
Board Holes
150
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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| 104346-1 | CONN HDR BRKWAY 3POS VERT TIN |
| SMAJ64A-13-F | TVS UNIDIRECT 400W 64V SMA |
| 1-1123723-5 | CONN HEADER .156 VERT 5POS TIN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 5-146290-4 | 功能描述:集管和线壳 04 MODII HDR SRST B/A 100 W/HD RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| 5-146290-5 | 功能描述:集管和线壳 05 MODII HDR SRST B/A 100 W/HD RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| 5-146290-6 | 功能描述:集管和线壳 06 MODII HDR SRST B/A 100 W/HD RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| 5-146290-7 | 制造商:TE Connectivity 功能描述:CONN UNSHRD HDR HDR 7 POS 2.54MM SLDR ST TH - Trays |
| 5-146290-8 | 制造商:TE Connectivity 功能描述:CONN UNSHRD HDR HDR 8 POS 2.54MM SLDR ST TH - Bulk |
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