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参数资料
| 型号： | 5-6450130-0 |
| 厂商： | Tyco Electronics |
| 元件分类： | 终端 |
| 英文描述： | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 中文描述： | MULTI–BEAM XL™ – Power Distribution (W–to–B) Connector System |
| 文件页数： | 18/52页 |
| 文件大小： | 5010K |
| 代理商： | 5-6450130-0 |
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Board-to-Board
Products
34
Catalog 1773096
Dimensions are in inches and
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Revised 2-10
millimeters unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are metric equivalents.
to change.
C. America: 52-55-1106-0803
UK: 44-(0)8002-67666
“NEW” MINIPAK HDL Connectors
Power Connectors & Interconnection Systems
Tyco Electronics’ new
MINIPAK HDL connector
combines a high-density
power interface into a blind-
mateable board-to-board
connector, which stands
only 8 mm off the edge of
the printed circuit board.
The MINIPAK HDL product
consists of a right-angle
plug and right-angle recep-
tacle, which utilizes an eye
of the needle tail that can
be used in both solder
and press-fit applications.
The contact offers a current
rating of 16 amps, low con-
tact resistance, and mating
forces less than 0.3 pounds
per contact.
The connector is designed
and manufactured to be
mass-customizable, allow-
ing the customer to select a
wide array of configurations
and layouts. MINIPAK HDL
connectors also contain
three levels of mating
sequences. This product is
designed specifically for
modular hot-swappable
power distribution systems.
The MINIPAK HDL connector
offers 20% more current
density in a smaller package
than other products cur-
rently offered in the market.
Product Facts
■ High-density, low profile,
power/signal, blind-mate
connector
■ Developed to meet next
generation 1U application
by reducing airflow
impedance
■ Design is customizable
■ Serves both solder reflow
and press-fit applications
with the same contact
Applications
■ 1U Servers
■ High End Servers
■ Telecommunications
Switches, requiring low
profile
■ Hot-pluggable power
supplies
Technical Documents
Product Specification
108-2325
Application Specification
114-13215
MINIPAK HDL
Temperature Rise Vs Current
8 Circuits 2 oz 2 Layer
Current DC Amperes
70
60
50
40
30
20
10
0
010
0 FPM
100 FPM
200 FPM
300 FPM
Power (0 FPM)
Power (100 FPM)
Power (200 FPM)
Power (300 FPM)
20
30
T
e
mperature
Rise
Degree
C
Temperature Rise Chart
8.00
[.315]
12.60
[.496]
Airflow
MULTIBEAM XL
Connector
MINIPAK HDL
Connector
Simulated Side View of 1U Chassis
NEW
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