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参数资料
| 型号： | 506-AG10D-ES |
| 元件分类： | 插座 |
| 英文描述： | DIP6, IC SOCKET |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/1页 |
| 文件大小： | 125K |
| 代理商： | 506-AG10D-ES |
506-AG10D-ES Product Details
506-AG10D-ES
(1437535-6)
T E I nternal N umber: 1 4 3 7 5 3 5 -6
DIP Sockets
Product Highlights:
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Socket Style = Standard
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Through Hole Contact Termination Type
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2.54 mm Centerline
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Row-to-Row Spacing = 7.62 mm
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6 Positions
Quick Links
Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
Additional Information:
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Related Products:
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Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
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Socket Style = Standard
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Profile = Standard
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Frame Style = Closed
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Leg Style = Straight
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Sleeve Material = Machined brass/formed copper
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Product Series = 500 Series
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Comment = Economy Series
Electrical Characteristics:
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Insulation Resistance (M?) = 5,000
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Contact Resistance (m?) = 10
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Contact Rating = 3A
Termination Related Features:
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Termination Post Length (mm [in]) = 3.18 [0.125]
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Solder Tail Contact Plating = Gold
Body Related Features:
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Centerline (mm [in]) = 2.54 [0.100]
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Row-to-Row Spacing (mm [in]) = 7.62 [0.300]
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Mount Style = Vertical
Contact Related Features:
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Contact Termination Type = Through Hole
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Contact Base Material = Beryllium Copper
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Contact Style = Screw Machine
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Mating Contact Type = Four-Fingered
Housing Related Features:
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Housing Material = Thermoplastic - GF
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Housing Flammability Rating = UL 94V-0
Configuration Related Features:
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Height Above PC Board (mm [in]) = 3.43 [0.135]
Industry Standards:
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RoHS/ELV Compliance = RoHS compliant, ELV compliant
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Lead Free Solder Processes = Wave solder capable to 240?C , Wave
solder capable to 260?C , Wave solder capable to 265?C
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RoHS/ELV Compliance History = Always was RoHS compliant
Conditions for Usage:
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Temperature Range (?C) = -55 – +125
Operation/Application:
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Application = Production
Packaging Related Features:
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Packaging Method = Tube
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Packaging Quantity = 80
Other:
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Brand = AMP
Corporate Information
Quick Links
Customer Support
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相关PDF资料 |
PDF描述 |
|---|---|
| 506-AG11D-ES | DIP6, IC SOCKET |
| 516-AG11D-ESL | DIP16, IC SOCKET |
| 524-AG13D | DIP24, IC SOCKET |
| 518-AG11D | DIP18, IC SOCKET |
| 540-AG10D | DIP40, IC SOCKET |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 506-AG10F | 制造商:AUGAT COMPONENTS 功能描述: 制造商:TE Connectivity 功能描述: 制造商:TE Connectivity 功能描述:DIP Socket,6 Contacts,0.1 Term Pitch,0.3 Row Spacing,PC TAIL Terminal |
| 506-AG11D | 功能描述:IC 与器件插座 VERT DIP CLOSED 6P RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 506-AG11D-ES | 功能描述:IC 与器件插座 PC MOUNT 6 PIN RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 506-AG11DESL | 制造商:TE Connectivity 功能描述:IC SOCKET DIL 6 WAY |
| 506-AG11D-ESL | 功能描述:CONN IC DIP SOCKET 6POS GOLD 制造商:te connectivity amp connectors 系列:500 包装:管件 零件状态:有效 类型:DIP，0.3"（7.62mm）行间距 针脚或引脚数（栅格）:6（2 x 3） 间距 - 配接:0.100"（2.54mm） 触头表面处理 - 配接:金 触头表面处理厚度 - 配接:- 触头材料 - 配接:铜合金 安装类型:通孔 特性:封闭框架 端接:焊接 间距 - 柱:0.100"（2.54mm） 触头表面处理 - 柱:金 触头表面处理厚度 - 柱:- 触头材料 - 柱:铜合金 外壳材料:聚酯 工作温度:-55°C ~ 125°C 端接柱长度:0.125"（3.18mm） 材料可燃性等级:UL94 V-0 额定电流:- 接触电阻:10 毫欧 标准包装:3,200 |
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