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参数资料
型号： 513302B02500G
厂商： Aavid Thermalloy
文件页数： 69/116页
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
产品培训模块： How to Select a Heat Sink
标准包装： 450
类型： 插件板级，垂直
冷却式包装： TO-220
固定方法： 螺栓固定和 PC 引脚
形状： 矩形
长度： 2.461"（63.50mm）
宽： 1.375"（34.93mm）
机座外的高度（散热片高度）： 0.500"（12.70mm）
温升时的功耗： 8W @ 60°C
在强制气流下的热敏电阻： 在 200 LFM 时为4.0°C/W
自然环境下的热电阻： 8°C/W
材质： 铝
材料表面处理： 黑色阳极化处理
其它名称： 041545
56
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5297, 5298, 5299, 5300
Extruded heat sink with large radial fins
Extruded heat sink with large radial
fins features equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220, TO-218, and TO-247 devices.
3.18
(0.125)
14.22
(0.560)
13.72
(0.540)
25.40
(1.000)
"C"
"A"
"B"
20.96
(0.825)
41.91
(1.650)
17.02
(0.670)
1.57
(0.062)
3.96
(0.156)
25.40
(1.000)
2.36
(0.093)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
52980X
52970X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
529701B02500G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529702B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529801B02500G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529802B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529901B02500G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529902B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
530001B02500G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
530002B02500G
TO-220
63.50 (2.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
53000X
52990X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
For additional options see page 83
TO-220 & TO-218 & TO-247 Heat Sinks
SW25, SW38, SW50, SW63
Extruded heat sink with unequal channel widths
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220, TO-218,
or TO-247 devices. Includes two solder-
able mounting pins which permit verti-
cal mounting and eliminate stress on
device leads. Available in three heights.
Version without hole uses clip 5901
(sold separately) to attach device.
See page 97 for clip information.
25.00
(0.984) 19.90
(0.783)
15.00
(0.591)
4.00
(0.157)
2.50
(0.098)
25.40
(1.000)
3.20
(0.126)
"A"
SEE NOTE 1
TYP
34.50
(1.358)
12.50
(0.492)
6.25
(0.246)
2.00
(0.079)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
SW38
SW25
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
“A” Dim
Holes
SW25-2G
Extruded heat sink with unequal channel widths front and back
25.00 (0.984)
No
3.00 (0.118)
SW25-4G
With device mounting holes
25.00 (0.984)
Yes
3.00 (0.118)
SW38-2G
Extruded heat sink with unequal channel widths front and back
38.00 (1.496)
No
3.00 (0.118)
SW38-4G
With device mounting holes
38.00 (1.496)
Yes
3.00 (0.118)
SW50-2G
Extruded heat sink with unequal channel widths front and back
50.00 (1.968)
No
3.00 (0.118)
SW50-4G
With device mounting holes
50.00 (1.968)
Yes
3.00 (0.118)
SW63-2G
Extruded heat sink with unequal channel widths front and back
63.00 (2.480)
No
3.00 (0.118)
SW63-4G
With device mounting holes
63.00 (2.480)
Yes
3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
SW63
SW50
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
NOTE 1: This hole not present in SW25 model
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相关代理商/技术参数
参数描述
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513302B02502G 功能描述:BOARD LEVEL HEAT SINK RoHS:是 类别:风扇，热管理 >> 热敏 - 散热器 系列:- 产品目录绘图:BDN12-3CB^A01 标准包装:300 系列:BDN 类型:顶部安装 冷却式包装:分类（BGA，LGA，CPU，ASIC……） 固定方法:散热带，粘合剂（含） 形状:方形，鳍片 长度:1.21"（30.73mm） 宽:1.210"（30.73mm） 直径:- 机座外的高度（散热片高度）:0.355"（9.02mm） 温升时的功耗:- 在强制气流下的热敏电阻:在 400 LFM 时为6.8°C/W 自然环境下的热电阻:19.6°C/W 材质:铝 材料表面处理:黑色阳极化处理 产品目录页面:2681 (CN2011-ZH PDF) 其它名称:294-1099
513302B12501 制造商:Aavid Thermalloy 功能描述:- Bulk
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5133-12H 制造商:TRUARC 功能描述:
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