参数资料
型号: 530BC25M0000DGR
厂商: Silicon Laboratories Inc
文件页数: 10/12页
文件大小: 0K
描述: 25MHZ OSC SMD 3.3V
标准包装: 100
系列: Si530
类型: XO(标准)
频率: 25MHz
功能: 三态(输出启用)
输出: LVDS
电源电压: 3.3V
频率稳定性: ±7ppm
工作温度: -40°C ~ 85°C
电流 - 电源(最大): 98mA
安装类型: 表面贴装
尺寸/尺寸: 0.276" L x 0.197" W(7.00mm x 5.00mm)
高度: 0.065"(1.65mm)
封装/外壳: 6-SMD,无引线(DFN,LCC)
包装: 带卷 (TR)
其它名称: Q5356282
Si530/531
6. 6-Pin PCB Land Pattern
Figure 4 illustrates the 6-pin PCB land pattern for the Si530/531. Table 14 lists the values for the dimensions shown
in the illustration.
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Figure 4. Si530/531 PCB Land Pattern
Table 14. PCB Land Pattern Dimensions (mm)
Dimension
C1
E
X1
Y1
(mm)
4.20
2.54
1.55
1.95
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between
the solder mask and the metal pad is to be 60 μm minimum, all the way around
the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
10
Rev. 1.4
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