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参数资料
| 型号： | 532-AG11D-LF |
| 元件分类： | 插座 |
| 英文描述： | DIP32, IC SOCKET |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 2/2页 |
| 文件大小： | 298K |
| 代理商： | 532-AG11D-LF |
3-1571550-0 Product Details
3-1571550-0
(532-AG11D-LF)
TE Internal Number: 3-1571550-0
Active
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DIP Sockets
Always EU RoHS/ELV Compliant
(Statement of
Compliance
)
Product Highlights:
Socket Style = Standard
Through Hole Contact Termination Type
2.54 mm Centerline
Row-to-Row Spacing = 15.24 mm
32 Positions
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Documentation & Additional Information
Product Drawings:
CLOSED FRAME DIP, PREMIUM LEAD FREE (REF AUGAT 500 S... (PDF, English)
Catalog Pages/Data Sheets:
None Available
Product Specifications:
None Available
Application Specifications:
None Available
Instruction Sheets:
None Available
CAD Files: (CAD Format & Compression Information)
2D Drawing (DXF, Version B)
3D Model (IGES, Version B)
3D Model (STEP, Version B)
List all Documents
Additional Information:
Product Line Information
Related Products:
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
Socket Style = Standard
Profile = Standard
Frame Style = Closed
Leg Style = Straight
Sleeve Material = Brass/Copper
Product Series = 500 Series
Electrical Characteristics:
Insulation Resistance (M) = 5,000
Contact Resistance (m) = 10
Termination Related Features:
Termination Post Length (mm [in]) = 3.18 [0.125]
Solder Tail Contact Plating = Tin
Body Related Features:
Centerline (mm [in]) = 2.54 [0.100]
Row-to-Row Spacing (mm [in]) = 15.24 [0.600]
Number of Positions = 32
Mount Style = Vertical
Contact Related Features:
Contact Termination Type = Through Hole
Contact Base Material = Beryllium Copper
Contact Plating, Mating Area, Material = Gold (25)
Contact Style = Screw Machine
Mating Contact Type = Four-Fingered
Housing Related Features:
Housing Material = Thermoplastic - GF
UL Flammability Rating = UL 94V-0
Configuration Related Features:
Height Above PC Board (mm [in]) = 3.43 [0.135]
Industry Standards:
RoHS/ELV Compliance = RoHS compliant, ELV compliant
Lead Free Solder Processes = Wave solder capable to 240°C,
Wave solder capable to 260°C, Wave solder capable to 265°C
RoHS/ELV Compliance History = Always was RoHS compliant
Conditions for Usage:
Temperature Range (°C) = -55 – +105
Packaging Related Features:
Packaging Method = Tube
Other:
Brand = Tyco Electronics
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Page 1 of 1
3-1571550-0 Product Details - Tyco Electronics
14-Feb-2011
http://www.tycoelectronics.com/catalog/pn/en/3-1571550-0?RQPN=532-AG11D-LF
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 532-AG11F | 制造商:AUGAT COMPONENTS 功能描述: 制造商:TE Connectivity 功能描述: |
| 532AG11F-ES | 功能描述:IC 与器件插座 GOLD CNT TIN SLV 32P RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 532-AG12D | 功能描述:IC 与器件插座 32P DIP SOCKET RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 532-AG38D | 制造商:TE Connectivity 功能描述: |
| 532-AG44D-ES | 制造商:TE Connectivity 功能描述: |
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