参数资料
| 型号： | 533702B02552G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 103/116页 |
| 文件大小： | 0K |
| 描述： | BOARD LEVEL HEAT SINK |
| 产品培训模块： | How to Select a Heat Sink |
| 标准包装： | 250 |
| 类型： | 插件板级，垂直 |
| 冷却式包装： | TO-220 |
| 固定方法： | 夹和 PC 引脚 |
| 形状： | 矩形 |
| 长度： | 1.00"（25.40mm） |
| 宽： | 1.650"（41.91mm） |
| 机座外的高度（散热片高度）： | 1.000"（25.40mm） |
| 温升时的功耗： | 12W @ 70°C |
| 在强制气流下的热敏电阻： | 在 200 LFM 时为4.0°C/W |
| 自然环境下的热电阻： | 5.7°C/W |
| 材质： | 铝 |
| 材料表面处理： | 黑色阳极化处理 |
| 其它名称： | 041778 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页当前第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页
87
INTERF
A
CE
MA
TERIALS
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Alignment Pads
Aavid Thermalloy has added a phase change
pad to its line-up. These pads provide low
thermal resistance and electrical isolation
for low pressure spring mount applications.
Above the phase change temperature the
material flows to fill in surface irregularities
and maximize the heat conduction path.
Interface Material/Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
Suffix
Device
Figure
8223-CL03G
TO-220
B
8241-CL11G
TO-218
A
Hi-Flow *
(1.000)
25.40
(0.030)
0.76
(0.122)
3.10
(0.985)
25.02
(0.520)
13.21
(1.200)
30.48
(0.860)
21.84
9.40
(0.370)
5.08
(0.200)
3.25
(0.128)
1
CLIP ASSEMBLY
CL
(0.460)
11.68
(0.300)
7.62
(0.670)
17.02
0.51
(0.020)
TYP THK
14.22
(0.560)
3.18
(0.125)
0.76
(0.030)
(0.860)
21.84
5.08
(0.200)
(0.790)
20.07
Figure A
ORDERING INFORMATION
example
Thermalloy origin part 7022B–8223–CL03 G
A
B
A = Model number
B = Alignment pad
C = RoHS compliant
Figure B
Typical installation
Shown with part number 8241-CL11
Recommended hole pattern for 8223-CL03G
Recommended hole pattern for 8241-CL11G
14.73
(0.580)
7.37
(0.290)
2.54
(0.100)
2.54
(0.100)
PLATED THRU HOLE PER
DEVICE MANUFACTURERS
RECOMMENDATION
2.95
(0.116)
DIA PLATED
THRU HOLE
25.40
(1.000)
12.70
(0.500)
5.46
(0.215)
2.95
(0.116)
DIA PLATED
THRU HOLE
5.46
(0.215)
1.60
(0.063)
DIA PLATED
THRU HOLE
TYP(3)
TYP(2)
C
Reinforcement carrier
Polymide
Thickness
0.127 (0.005)
Continuous use temp (°C)
150
Phase change temp(°C)
55
Dielectric breakdown voltage (Vac)
5000
Dielectric constant (1000 Hz)
4.5
Volume resistivity (Ohm-meter)
1012
MATERIAL PROPERTIES
(1.650)
41.91
(1.140)
28.96
2X
(0.093)
2.36
2X
(0.140)
3.56
21.84
(0.860)
18.80
(0.740)
2.69
(0.160)
16.76
(0.660)
DIA
19.05
(0.750)
12.70
(0.500)
3.73
(0.147)
14.30
(0.563)
DIA
TO-3
TO-220
TO-218
530101B _ 5150G
Ordering code
ORDERING INFORMATION
example 12 digit part
Ordering code
Description
0
No pads
7
One Hi-Flow pad
8
Two Hi-Flow pads
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used. To order
additional Hi-Flow pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Thermal impedance vs. pressure
Pressure
10
25
50
200
TO-220 Thermal performance (C/W)
1.15
1.14
1.12
1.1
* Hi-Flow is a registered trademark of the Bergquist Company
相关PDF资料 |
PDF描述 |
|---|---|
| TX25-60P-8ST-E1E | CONN PLUG 1.27MM 60POS GOLD PCB |
| TX25-60P-6ST-H1E | CONN PLUG 1.27MM 60POS GOLD PCB |
| 1785/34 200 | CABLE 34 COND FLAT TWSTD PR .05" |
| 1785/40 200 | CABLE 40 COND FLAT TWSTD PR .05" |
| TX25-60P-6ST-E1E | CONN PLUG 1.27MM 60POS GOLD PCB |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 533703 | 制造商:PAULSTRA 功能描述:MOUNT AV PAULSTRADYN 533703 制造商:PAULSTRA 功能描述:MOUNT, AV, PAULSTRADYN, 533703 制造商:PAULSTRA 功能描述:MOUNT, AV, PAULSTRADYN, 533703; External Diameter:12mm; External Depth:40mm; Body Length:40mm; Compression Load Max:12; External Length / Height:44mm; External Width:64mm; Thread Size:M6 ;RoHS Compliant: Yes |
| 533704 | 制造商:PAULSTRA 功能描述:MOUNT AV PAULSTRADYN 533704 制造商:PAULSTRA 功能描述:MOUNT, AV, PAULSTRADYN, 533704 制造商:PAULSTRA 功能描述:MOUNT, AV, PAULSTRADYN, 533704; External Diameter:32mm; External Depth:40mm; Body Length:60mm; Compression Load Max:20; External Length / Height:64mm; External Width:90mm; Thread Size:M6 ;RoHS Compliant: Yes |
| 533705 | 制造商:PAULSTRA 功能描述:MOUNT AV PAULSTRADYN 533705 制造商:PAULSTRA 功能描述:MOUNT, AV, PAULSTRADYN, 533705 |
| 533706 | 制造商:PAULSTRA 功能描述:MOUNT AV PAULSTRADYN 533706 制造商:PAULSTRA 功能描述:MOUNT, AV, PAULSTRADYN, 533706 制造商:PAULSTRA 功能描述:MOUNT, AV, PAULSTRADYN, 533706; External Diameter:32mm; External Depth:40mm; Body Length:60mm; Compression Load Max:50; External Length / Height:64mm; External Width:90mm; Thread Size:M6 ;RoHS Compliant: Yes |
| 533708 | 制造商:PAULSTRA 功能描述:MOUNT AV PAULSTRADYN 533708 制造商:PAULSTRA 功能描述:MOUNT, AV, PAULSTRADYN, 533708 |
发布紧急采购，3分钟左右您将得到回复。