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参数资料
| 型号： | 5390175-6 |
| 元件分类： | 边缘插接连接器 |
| 英文描述： | 168 CONTACT(S), FEMALE, RIGHT ANGLE SINGLE PART CARD EDGE CONN, SOLDER, SOCKET |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/1页 |
| 文件大小： | 109K |
| 代理商： | 5390175-6 |
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5390175-6 Product Details
No Im age Available
5390175-6
T E I nternal N umber: 5 3 9 0 1 7 5 -6
Memory Sockets
Product Highlights:
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DIMM
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Gold Contact Mating Area Plating Material
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Number of Positions = 168
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DRAM Type = Non-Buffered
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DRAM Voltage = 3.3 V
Quick Links
Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files: (CAD Format & Compression Information)
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2D Drawing (DXF, Version B)
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3D Model (IGES, Version B)
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3D Model (STEP, Version B)
Additional Information:
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Related Products:
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Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type = DIMM
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Number of Positions = 168
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DRAM Type = Non-Buffered
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PCB Mount Style = Through Hole
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Module Orientation = Right Angle
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PCB Retention Feature = Yes
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Profile = Low
Mechanical Attachment:
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Center Retention Hole Diameter (mm [in]) = 2.40 [0.094]
Electrical Characteristics:
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DRAM Voltage = 3.3 V
Termination Related Features:
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Termination Post Length (mm [in]) = 3.18 [0.125]
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Solder Tail Contact Plating = Tin over Nickel
Body Related Features:
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Row-to-Row Spacing (mm [in]) = 1.90 [0.075]
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Centerline (mm [in]) = 1.27 [0.050]
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Number of Rows = Dual
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Ejector Type = Standard
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Ejector Location = Both Ends
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Center Post = With
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Number of Keys = 2
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PCB Retention Method = Boardlock(s)
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Mount Type = Printed Circuit Board
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Module Key Type = Key1= Offset Left / Key2= Center
Contact Related Features:
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Contact Mating Area Plating Material = Gold
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Contact Base Material = Phosphor Bronze
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Retention Post(s) Location = Center
Housing Related Features:
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Housing Material = High Temperature Nylon
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Housing Color = Black
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Housing Flammability Rating = UL 94V-0
Configuration Related Features:
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Insertion Style = Direct Insert
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Center Key (mm [in]) = Center
Industry Standards:
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RoHS/ELV Compliance = RoHS compliant, ELV compliant
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Lead Free Solder Processes = Wave solder capable to 240?C , Wave
solder capable to 260?C , Wave solder capable to 265?C
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RoHS/ELV Compliance History = Always was RoHS compliant
Packaging Related Features:
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Packaging Method = Tray
Other:
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Brand = AMP
相关PDF资料 |
PDF描述 |
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| 53M15-01-1-23N | ROTARY SWITCH-23POSITIONS, SP23T, LATCHED, 0.25A, 28VDC, PANEL MOUNT |
| 53M15-01-2-11N | ROTARY SWITCH-11POSITIONS, DP11T, LATCHED, 0.25A, 28VDC, PANEL MOUNT |
| 53M15-02-1-12N | ROTARY SWITCH-12POSITIONS, SP12T, LATCHED, 0.25A, 28VDC, PANEL MOUNT |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 5390185-4 | 制造商:TE Connectivity 功能描述:CONN DIMM SCKT SKT 168 POS 2.54MM SLDR TH - Bulk 制造商:TE CONNECTIVITY 功能描述:SKT,DIMM IIP,168,L/P,STD DRAM, |
| 5390185-6 | 功能描述:IC 与器件插座 DIMM2P 168P NDRAM/EDO RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 5390195-4 | 功能描述:DDR3 / DDR2 / DDR 连接器 SKT DIMM IIP 168 L/P STD DRAM PB-FREE RoHS:否 制造商:Molex 产品类型:DIMM 系列:78588 节距:1 mm 位置/触点数量:240 安装风格:Through Hole 安装角:Vertical 外壳材料:Thermoplastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:29 V 电流额定值:1 A 长度: |
| 5390195-6 | 功能描述:IC 与器件插座 SKT DIMM IIP 168 L/P NB DRAM PBF RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 5390213-1 | 功能描述:DDR3 / DDR2 / DDR 连接器 DIMM SKT 100P 2.54mm RoHS:否 制造商:Molex 产品类型:DIMM 系列:78588 节距:1 mm 位置/触点数量:240 安装风格:Through Hole 安装角:Vertical 外壳材料:Thermoplastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:29 V 电流额定值:1 A 长度: |
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