参数资料
型号: 53RBD-R22-A22/A22
厂商: Bourns Inc.
文件页数: 2/3页
文件大小: 0K
描述: POT 250K OHM 1/2" SQ 1W CERMET
产品变化通告: Plastic Change 24/Jun/2011
标准包装: 5
系列: 53
电阻(欧姆): 250k
功率(瓦特): 1W
容差: ±10%
温度系数: ±150ppm/°C
匝数: 单路
旋转: 290°
调节型: 侧面调节
电阻材料: 金属陶瓷
端接类型: 焊片
触动器长度: 0.866"(22.00mm)
触动器类型: 开槽轴
触动器直径: 0.236"(6.00mm)
尺寸 - 主体: 方形 - 0.650" L x 0.492" W x 0.522" H(16.51mm x 12.50mm x 13.25mm)
安装类型: 面板安装
包装: 散装
其它名称: Q1321781
51/53 - Sealed 1/2 ” (12.5 mm) Square Control
Product Dimensions
PACKAGE DIMENSIONS
7.62
FMS
16.51 ± 0.25
(.650 ± .010)
8.89 ± 0.18
(.350 ± .007)
.64
"L"
( .025)
11.00
(.432)
DIA.
MODEL 51
12.5
(.492)
6.25
(.246)
TYP.
2.54
6.35
(.250)
(.300)
5.08
(.200)
1.32
(.052)
7.00
(.100)
0.74
(.029)
(.275)
CL OF POT
(.050)
DIA.
4 PLCS.
7.62 ± 0.30
(.300 ± .012)
0.30
(.0118)
5.08 ± 0.30
(.200 ± .012)
3X
.66 ± .05
(.026 ± .002)
6.60 ±0.38
(.260 ± .015)
2.54
(.100)
1.27
1.02
(.040)
DIA.
6 PLCS.
(DOUBLE MODULE FRONT AND REAR BRACKET SHOWN)
2.54
(.100)
(SINGLE AND DUAL MODULE SHOWN)
PACKAGE DIMENSIONS PCB MOUNTING BRACKET
2.54
(.100) TERMINAL SPACING
12.5
SOLDER LUG TERMINALS
MODEL 53
"L"
.64
( .025)
11.00
(.432)
DIA.
(.492)
6.25
(.246)
7.00
2.40
3
2
1
5.0 ± 0.51
0.74
(.275)
(.094)
(.197 ± .020)
(.029)
0.91 ± .051
(.036 ± .002)
6.35 ± .25
(.250 ± .010)
1.32 ± 0.25
(.052 ± .010)
5.08 ± 0.30
(.200 ± .012)
7.62 ± 0.30
(.300 ± .012)
2X
.41 ± .05
( .016 ± .002)
5.08
(.200)
2.54
2X
(.100)
6.60 ±0.38
(.260 ± .015)
5.08
(.200)
0.90 1.80
(.036) (.071)
4.70
2X
(.185)
ELECTRICAL SCHEMATIC
CCW 1 3
CW
2
ANTI-ROTATION LUG
SHAFT FLAT
SUGGESTED PANEL LAYOUT
(Style "A" Shown)
0.41
5.70
(.224)
ORIENTATION
6.20
0.80 ± 0.30
(.031 ± .012)
(.016)
1.52
(.244)
(.060)
132 ° ± 5 °
2.26
(.089)
DIA.
CCW END
BUSHING DIAMETER
TOLERANCE
+0.25
( +.010)
.25
FOR TOLERANCES SHOWN: .XX = ± (.010)
.XXX = ± .13
(.005)
SHAFT DIMENSIONS ± .80
(1/32)
DIMENSIONS:
MM
(INCHES)
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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